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通过有机胺改性银纳米颗粒浆料的无压烧结形成高强度芯片粘结接头。

High Strength Die-Attach Joint Formation by Pressureless Sintering of Organic Amine Modified Ag Nanoparticle Paste.

作者信息

Shen Xingwang, Li Junjie, Xi Shuang

机构信息

College of Mechanical and Electronic Engineering, Nanjing Forestry University, Nanjing 210037, China.

Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518100, China.

出版信息

Nanomaterials (Basel). 2022 Sep 26;12(19):3351. doi: 10.3390/nano12193351.

Abstract

Sintered silver (Ag) die-attach has attracted much attention in power systems with high power density and high operating temperature. In this paper, we proposed a novel surface modification method for Ag nanoparticles with organic amines as a coating agent for enhancing the pressureless sintering performance. This work systematically introduced the Ag nanoparticle modification process, Ag paste preparation, and sintering process and compared the changes in the sintering performance of Ag nanoparticles after modification with four different alkyl chain lengths of amines. The study showed that the sintered films of Ag nanoparticle pastes modified with -octylamine (NOA) can achieve the lowest resistivity of the sintered film and the highest shear strength of the bonded joints. The resistivity of the sintered Ag film is affected by the grain size and microscopic morphology, and the strength of the bonded joints is also related to the sintering density and the amount of organic residues. The thermal behavior of the Ag particles coated with different amines is measured by thermal analysis. Finally, the mechanism of NOA-modified Ag nanoparticles to improve the sintering performance is proposed. This study can provide effective data and theoretical support for the further promotion and application of nano-Ag pressureless sintering.

摘要

烧结银(Ag)芯片键合在高功率密度和高工作温度的电力系统中备受关注。本文提出了一种以有机胺为包覆剂的新型银纳米颗粒表面改性方法,以提高无压烧结性能。这项工作系统地介绍了银纳米颗粒改性过程、银膏制备和烧结过程,并比较了用四种不同烷基链长度的胺改性后银纳米颗粒烧结性能的变化。研究表明,用正辛胺(NOA)改性的银纳米颗粒膏体烧结膜可实现烧结膜的最低电阻率和键合接头的最高剪切强度。烧结银膜的电阻率受晶粒尺寸和微观形态的影响,键合接头的强度也与烧结密度和有机残留物的量有关。通过热分析测量了不同胺包覆的银颗粒的热行为。最后,提出了NOA改性银纳米颗粒改善烧结性能的机理。该研究可为纳米银无压烧结的进一步推广应用提供有效的数据和理论支持。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/b01f/9565494/e3d7f2ad2e41/nanomaterials-12-03351-g001.jpg

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