Li Na, Li Jun, Wan Xiaoxi, Niu Yifan, Gu Yongwan, Chen Guo, Ju Shaohua
Faculty of Metallurgical and Energy Engineering, Kunming University of Science and Technology, Kunming 650093, China.
Key Laboratory of Unconventional Metallurgy, Ministry of Education, Kunming 650093, China.
Materials (Basel). 2023 Feb 20;16(4):1733. doi: 10.3390/ma16041733.
In this paper, micro-size spherical silver particles were prepared by using a wet-chemical reduction method. The silver particles were characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD) and a laser particle-size analyzer. The results indicate that different types and the content of surfactants can be used to prevent the accumulation, and control the morphology and particle size distribution, of silver particles. Moreover, the morphology of silver particles was changed from polyhedral to spherical when the pH was raised from 1 to 3. Under the optimal synthesis conditions (0.1 mol/L silver nitrate, 0.06 mol/L ascorbic acid, gelatin (5% by weight of silver nitrate), pH = 1), the micro-size spherical silver particles with diameter of 5-8 μm were obtained. In addition, the resistivity of conductive silver paste that prepared with the as-synthesized spherical silver particles was discussed in detail and the average resistivity of the conductive silver paste was 3.57 × 10 Ω·cm after sintering at 140 °C for 30 min.
本文采用湿化学还原法制备了微米级球形银颗粒。通过扫描电子显微镜（SEM）、X射线衍射（XRD）和激光粒度分析仪对银颗粒进行了表征。结果表明，不同类型和含量的表面活性剂可用于防止银颗粒的聚集，并控制其形态和粒度分布。此外，当pH值从1提高到3时，银颗粒的形态从多面体变为球形。在最佳合成条件（0.1 mol/L硝酸银、0.06 mol/L抗坏血酸、明胶（硝酸银重量的5%）、pH = 1）下，获得了直径为5 - 8μm的微米级球形银颗粒。此外，详细讨论了用合成的球形银颗粒制备的导电银浆的电阻率，在140℃烧结30 min后，导电银浆的平均电阻率为3.57×10Ω·cm。
