Li Weibing, Wang Xiao, Feng Xiaobin, Du Yao, Zhang Xu, Xie Yong, Chen Xiaoming, Lu Yang, Wang Weidong
ZNDY of Ministerial Key Laboratory, Nanjing University of Science and Technology, Nanjing 210094, China.
School of Mechano-Electronic Engineering, Xidian University, Xi'an 710071, China.
Nanomaterials (Basel). 2022 Mar 21;12(6):1022. doi: 10.3390/nano12061022.
As a representative of immiscible alloy systems, the Cu-Ta system was the research topic because of its potential application in industry, military and defense fields. In this study, an amorphous Cu-Ta alloy film was manufactured through magnetron sputter deposition, which was characterized by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Mechanical properties of Cu-Ta film were detected by the nanoindentation method, which show that the elastic modulus of Cu3.5Ta96.5 is 156.7 GPa, and the hardness is 14.4 GPa. The nanoindentation process was also simulated by molecular dynamic simulation to indicate the deformation mechanism during the load-unload stage. The simulation results show that the structure <0,2,8,4> and <0,2,8,5> Voronoi cells decreased by 0.1% at 50 Ps and then remained at this value during the nanoindentation process. In addition, the number of dislocations vary rapidly with the depth between indenter and surface. Based on the experimental and simulation results, the Voronoi structural changes and dislocation motions are the key reasons for the crystallization of amorphous alloys when loads are applied.
作为不混溶合金体系的代表,Cu-Ta体系因其在工业、军事和国防领域的潜在应用而成为研究课题。在本研究中,通过磁控溅射沉积制备了非晶Cu-Ta合金薄膜,并用扫描电子显微镜(SEM)和透射电子显微镜(TEM)对其进行了表征。采用纳米压痕法检测了Cu-Ta薄膜的力学性能,结果表明Cu3.5Ta96.5的弹性模量为156.7 GPa,硬度为14.4 GPa。还通过分子动力学模拟对纳米压痕过程进行了模拟,以揭示加载-卸载阶段的变形机制。模拟结果表明,在50 Ps时,结构<0,2,8,4>和<0,2,8,5>的Voronoi胞减少了0.1%,然后在纳米压痕过程中保持在该值。此外,位错数量随压头与表面之间的深度迅速变化。基于实验和模拟结果,Voronoi结构变化和位错运动是加载时非晶合金结晶的关键原因。