Guo Cong, Li Yuhan, Xu JianHua, Zhang Qin, Wu Kai, Fu Qiang
College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, P. R. China.
College of Chemistry and Green Catalysis Center, Zhengzhou Key Laboratory of Elastic Sealing Materials, Zhengzhou University, Zhengzhou 450001, China.
Mater Horiz. 2022 Jun 6;9(6):1690-1699. doi: 10.1039/d2mh00276k.
The dramatic miniaturization and integration of electronic devices call for next-generation thermally conductive interface materials with higher service performance and long-term stability. In addition to enhancing the inherent thermal conductivity of materials, it is noteworthy to pay attention to the thermal contact resistance. Herein, we synthesized a polyurethane with hierarchical hydrogen bonding to realize high surface adhesion with substrates; another key was incorporating aluminum oxide modified by a deformable liquid metal to improve the thermo-conductive capability and offer the freedom of polymeric segmental motions. These molecular and structural designs endow the composite with high isotropic thermal conductivity, electrical insulation and temperature-responsive reversible adhesion, which enable low thermal resistance and durable thermal contact with substrates without the need for external pressure.
电子设备的大幅小型化和集成化要求下一代热界面材料具有更高的使用性能和长期稳定性。除了提高材料的固有热导率外，热接触电阻也值得关注。在此，我们合成了一种具有分级氢键的聚氨酯，以实现与基材的高表面附着力；另一个关键是加入由可变形液态金属改性的氧化铝，以提高导热能力并为聚合物链段运动提供自由度。这些分子和结构设计赋予复合材料高各向同性热导率、电绝缘性和温度响应可逆附着力，使其能够实现低热阻并与基材进行持久的热接触，而无需外部压力。
