Gao Ge, Zhao Yuwei, Cao Wenxin, Su Zhenhua, Wang Xiaolei, Wang Zhuochao, Sun Tingting, Dai Bing, Han Jiecai, Li Bohong, Wang Chao, Zhu Jiaqi
National Key Laboratory of Science and Technology on Advanced Composites in Special Environments, Harbin Institute of Technology, Harbin, 150080, P. R. China.
Luoyang Ship Material Research Institute, Luoyang, Henan, 471000, P. R. China.
Small. 2024 Nov;20(44):e2403490. doi: 10.1002/smll.202403490. Epub 2024 Jul 19.
The miniaturization, integration, and increased power of electronic devices have exacerbated serious heat dissipation issues. Thermally conductive adhesives, which effectively transfer heat and firmly bond components, are critical for addressing these challenges. This paper innovatively proposed a composite comprising inorganic phosphate/alumina as a matrix and diamond as filler. The composite achieved an isotropic thermal conductivity (TC) of up to 18.96 W m K, significantly surpassing existing reports while maintaining electrical insulation. First-principles calculations and experimental tests confirmed that the high TC of phosphate and excellent interface contact ensured efficient heat transfer. To optimize bonding performance, a modified-diamond/Al(HPO)@epoxy hybrid composite is subsequently developed using an organic modification method. The unique hybrid structure, combining inorganic thermal pathways and an organic adhesive network, enabled the hybrid composite to simultaneously possess a high TC (3.23 W m K) and strong adhesion (14.35 MPa). Compared to previous reports, the comprehensive performance of this hybrid thermally conductive adhesive is exceptionally remarkable. The superior heat dissipation capability of the hybrid thermal adhesive is demonstrated in chip cooling scenarios. This organic/inorganic hybrid approach offered a new direction for obtaining advanced thermal interface materials, demonstrating significant application potential in chip soldering, packaging, and heat dissipation.
电子设备的小型化、集成化以及功率的增加加剧了严重的散热问题。导热胶粘剂能够有效地传递热量并牢固地粘结部件，对于应对这些挑战至关重要。本文创新性地提出了一种以无机磷酸盐/氧化铝为基体、金刚石为填料的复合材料。该复合材料实现了高达18.96 W m⁻¹ K⁻¹的各向同性热导率，在保持电绝缘性的同时显著超越了现有报道。第一性原理计算和实验测试证实，磷酸盐的高导热率和优异的界面接触确保了高效的热传递。为了优化粘结性能，随后采用有机改性方法开发了一种改性金刚石/Al(HPO₄)@环氧树脂杂化复合材料。这种独特的杂化结构将无机热传导路径和有机胶粘剂网络相结合，使杂化复合材料同时具备高导热率（3.23 W m⁻¹ K⁻¹）和强粘结力（14.35 MPa）。与先前的报道相比，这种杂化导热胶粘剂的综合性能格外突出。杂化导热胶粘剂在芯片冷却场景中展现出卓越的散热能力。这种有机/无机杂化方法为获得先进的热界面材料提供了新方向，在芯片焊接、封装和散热方面显示出巨大的应用潜力。
