Yang Guannan, Luo Shaogen, Lai Tao, Lai Haiqi, Luo Bo, Li Zebo, Zhang Yu, Cui Chengqiang
State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, China.
Jihua Laboratory, Foshan 528225, China.
Nanomaterials (Basel). 2022 Mar 24;12(7):1063. doi: 10.3390/nano12071063.
In this work, we developed an eco-friendly and facile microvia filling method by using printing and sintering of Cu-Ag core-shell nano-microparticles (Cu@Ag NMPs). Through a chemical reduction reaction in a modified silver ammonia solution with L-His complexing agent, Cu@Ag NMPs with compact and uniform Ag shells, excellent sphericity and oxidation resistance were synthesized. The as-synthesized Cu@Ag NMPs show superior microvia filling properties to Cu nanoparticles (NPs), Ag NPs, and Cu NMPs. By developing a dense refill method, the porosity of the sintered particles within the microvias was significantly reduced from ~30% to ~10%, and the electrical conductivity is increased about twenty-fold. Combing the Cu@Ag NMPs and the dense refill method, the microvias could obtain resistivities as low as 7.0 and 6.3 μΩ·cm under the sintering temperatures of 220 °C and 260 °C, respectively. The material and method in this study possess great potentials in advanced electronic applications.
在这项工作中，我们通过使用铜银核壳纳米微粒（Cu@Ag NMPs）的印刷和烧结开发了一种环保且简便的微通孔填充方法。通过在含有L-组氨酸络合剂的改性银氨溶液中进行化学还原反应，合成了具有致密且均匀银壳、优异球形度和抗氧化性的Cu@Ag NMPs。所合成的Cu@Ag NMPs在微通孔填充性能方面优于铜纳米颗粒（NPs）、银纳米颗粒和铜纳米微粒。通过开发一种致密填充方法，微通孔内烧结颗粒的孔隙率从约30%显著降低至约10%，电导率提高了约二十倍。将Cu@Ag NMPs与致密填充方法相结合，在220℃和260℃的烧结温度下，微通孔的电阻率分别可低至7.0和6.3μΩ·cm。本研究中的材料和方法在先进电子应用中具有巨大潜力。
