Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University , Yamadaoka 2-1, Suita, Osaka, Japan.
The Institute of Scientific and Industrial Research, Osaka University , Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan.
ACS Appl Mater Interfaces. 2017 Jul 26;9(29):24711-24721. doi: 10.1021/acsami.7b05308. Epub 2017 Jul 17.
Printable and flexible Cu-Ag alloy electrodes with high conductivity and ultrahigh oxidation resistance have been successfully fabricated by using a newly developed Cu-Ag hybrid ink and a simple fabrication process consisting of low-temperature precuring followed by rapid photonic sintering (LTRS). A special Ag nanoparticle shell on a Cu core structure is first created in situ by low-temperature precuring. An instantaneous photonic sintering can induce rapid mutual dissolution between the Cu core and the Ag nanoparticle shell so that core-shell structures consisting of a Cu-rich phase in the core and a Ag-rich phase in the shell (Cu-Ag alloy) can be obtained on flexible substrates. The resulting Cu-Ag alloy electrode has high conductivity (3.4 μΩ·cm) and ultrahigh oxidation resistance even up to 180 °C in an air atmosphere; this approach shows huge potential and is a tempting prospect for the fabrication of highly reliable and cost-effective printed electronic devices.
采用新型的 Cu-Ag 混合油墨和低温预固化 followed by 快速光子烧结（LTRS）的简单制造工艺，成功制备出具有高导电性和超高氧化稳定性的可打印和可拉伸的 Cu-Ag 合金电极。在低温预固化过程中，首先在原位形成特殊的 Cu 核 Ag 纳米颗粒壳结构。瞬时光子烧结可以促使 Cu 核与 Ag 纳米颗粒壳之间的快速相互溶解，从而在柔性基底上获得富含 Cu 的核和富含 Ag 的壳（Cu-Ag 合金）的核壳结构。所得的 Cu-Ag 合金电极具有高导电性（3.4μΩ·cm）和超高氧化稳定性，即使在空气气氛中 180°C 下也能保持稳定；这种方法具有巨大的潜力，是制造高可靠性和高性价比的印刷电子产品的诱人前景。
