Butkutė Agnė, Merkininkaitė Greta, Jurkšas Tomas, Stančikas Jokūbas, Baravykas Tomas, Vargalis Rokas, Tičkūnas Titas, Bachmann Julien, Šakirzanovas Simas, Sirutkaitis Valdas, Jonušauskas Linas
Femtika Ltd., Saulėtekio Ave. 15, LT-10224 Vilnius, Lithuania.
Laser Research Center, Vilnius University, Saulėtekio Ave. 10, LT-10223 Vilnius, Lithuania.
Materials (Basel). 2022 Apr 12;15(8):2817. doi: 10.3390/ma15082817.
Selective laser etching (SLE) is a technique that allows the fabrication of arbitrarily shaped glass micro-objects. In this work, we show how the capabilities of this technology can be improved in terms of selectivity and etch rate by applying an etchant solution based on a Potassium Hydroxide, water, and isopropanol mixture. By varying the concentrations of these constituents, the wetting properties, as well as the chemical reaction of fused silica etching, can be changed, allowing us to achieve etching rates in modified fused silica up to 820 μm/h and selectivity up to ∼3000. This is used to produce a high aspect ratio (up to 1:1000), straight and spiral microfluidic channels which are embedded inside a volume of glass. Complex 3D glass micro-structures are also demonstrated.
选择性激光蚀刻(SLE)是一种能够制造任意形状玻璃微物体的技术。在这项工作中,我们展示了通过应用基于氢氧化钾、水和异丙醇混合物的蚀刻剂溶液,如何在选择性和蚀刻速率方面提高该技术的性能。通过改变这些成分的浓度,可以改变润湿性以及熔融石英蚀刻的化学反应,使我们能够在改性熔融石英中实现高达820μm/h的蚀刻速率和高达约3000的选择性。这被用于制造高纵横比(高达1:1000)、笔直和螺旋形的微流体通道,这些通道嵌入在一定体积的玻璃内部。还展示了复杂的三维玻璃微结构。