Selemani Major A, Castiaux Andre D, Martin R Scott
Department of Chemistry, Saint Louis University, 3501 Laclede Ave., St. Louis, Missouri 63103, United States.
Center for Additive Manufacturing, Saint Louis University, 240 N Grand Blvd, Saint Louis, Missouri 63103, United States.
ACS Omega. 2022 Apr 8;7(15):13362-13370. doi: 10.1021/acsomega.2c01265. eCollection 2022 Apr 19.
In this work, we demonstrate the ability to use micromolds along with a stacked three-dimensional (3D) printing process on a commercially available PolyJet printer to fabricate microchip electrophoresis devices that have a T-intersection, with channel cross sections as small as 48 × 12 μm being possible. The fabrication process involves embedding removable materials or molds during the printing process, with various molds being possible (wires, brass molds, PDMS molds, or sacrificial materials). When the molds are delaminated/removed, recessed features complementary to the molds are left in the 3D prints. A thermal lab press is used to bond the microchannel layer that also contains printed reservoirs against another solid 3D-printed part to completely seal the microchannels. The devices exhibited cathodic electroosmotic flow (EOF), and mixtures of fluorescein isothiocyanate isomer I (FITC)-labeled amino acids were successfully separated on these 3D-printed devices using both gated and pinched electrokinetic injections. While this application is focused on microchip electrophoresis, the ability to 3D-print against molds that can subsequently be removed is a general methodology to decrease the channel size for other applications as well as to possibly integrate 3D printing with other production processes.
在这项工作中,我们展示了利用微模具以及在商用PolyJet打印机上进行堆叠式三维(3D)打印工艺来制造具有T形交叉点的微芯片电泳装置的能力,其通道横截面小至48×12μm成为可能。制造过程包括在打印过程中嵌入可移除材料或模具,有多种模具可供选择(金属丝、黄铜模具、聚二甲基硅氧烷(PDMS)模具或牺牲材料)。当模具分层/移除后,与模具互补的凹陷特征会留在3D打印件中。使用热实验室压力机将包含打印储液器的微通道层与另一个实心3D打印部件粘合,以完全密封微通道。这些装置表现出阴极电渗流(EOF),并且使用门控和夹点电动进样在这些3D打印装置上成功分离了异硫氰酸荧光素异构体I(FITC)标记的氨基酸混合物。虽然此应用专注于微芯片电泳,但针对随后可移除的模具进行3D打印的能力是一种通用方法,可减小其他应用的通道尺寸,并可能将3D打印与其他生产工艺集成。