Matsuda Shofu, Itagaki Chikara, Tatsuguchi Kyoya, Ito Masamichi, Sasaki Hiroto, Umeda Minoru
Department of Materials Science and Technology, Graduate School of Engineering, Nagaoka University of Technology, 1603-1 Kamitomioka, Nagaoka, Niigata, 940-2188, Japan.
Sci Rep. 2022 May 4;12(1):7294. doi: 10.1038/s41598-022-10983-6.
Triphenylamine derivatives are superior hole-transport materials. For their application to high-functional organic semiconductor devices, efficient hole injection at the electrode/triphenylamine derivative interface is required. Herein, we report the design and evaluation of a Au/fullerene-doped α-phenyl-4'-[(4-methoxyphenyl)phenylamino]stilbene (TPA) buffer layer/TPA/Au layered device. It exhibits rectification conductivity, indicating that hole injection occurs more easily at the Au/fullerene-doped TPA interface than at the Au/TPA interface. The Richardson-Schottky analysis of the device reveals that the hole injection barrier (Φ) at the Au/fullerene-doped TPA interface decreases to 0.021 eV upon using C as a dopant, and Φ of Au/TPA is as large as 0.37 eV. The reduced Φ of 0.021 eV satisfies the condition for ohmic contact at room temperature (Φ [Formula: see text] 0.025 eV). Notably, C doping has a higher barrier-reduction effect than C doping. Furthermore, a noteworthy hole-injection mechanism, in which the ion-dipole interaction between TPA and fullerenes plays an important role in reducing the barrier height, is considered based on cyclic voltammetry. These results should facilitate the design of an electrode/organic semiconductor interface for realizing low-voltage driven organic devices.
三苯胺衍生物是优良的空穴传输材料。对于它们在高功能有机半导体器件中的应用,需要在电极/三苯胺衍生物界面处实现高效的空穴注入。在此,我们报道了一种Au/富勒烯掺杂的α-苯基-4'-[(4-甲氧基苯基)苯基氨基]芪(TPA)缓冲层/TPA/Au层状器件的设计与评估。该器件呈现出整流导电性,这表明空穴注入在Au/富勒烯掺杂的TPA界面处比在Au/TPA界面处更容易发生。对该器件的理查森-肖特基分析表明,使用C作为掺杂剂时,Au/富勒烯掺杂的TPA界面处的空穴注入势垒(Φ)降至0.021 eV,而Au/TPA的Φ高达0.37 eV。0.021 eV的降低后的Φ满足室温下欧姆接触的条件(Φ [公式:见正文] 0.025 eV)。值得注意的是,C掺杂比C掺杂具有更高的势垒降低效果。此外,基于循环伏安法考虑了一种值得注意的空穴注入机制,其中TPA与富勒烯之间的离子-偶极相互作用在降低势垒高度方面起着重要作用。这些结果应有助于设计用于实现低压驱动有机器件的电极/有机半导体界面。