Gu Jinjie, Huang Lirong, Liu Shengzong
Hunan Provincial Key Laboratory of Finance & Economics Big Data Science and Technology, School of Information Technology and Management, Hunan University of Finance and Economics Changsha 410205 P. R. China
RSC Adv. 2019 Nov 7;9(62):36301-36307. doi: 10.1039/c9ra07828b. eCollection 2019 Nov 4.
Monolayer KCuTe is a new-type of two-dimensional (2D) semiconductor material with high carrier mobility and large power energy conversion efficiencies, suggesting its potential application in thermoelectric (TE) and photoelectric fields. Based on the density functional theory (DFT) and semiclassical Boltzmann transport equation, the electronic and phonon transport properties of monolayer KCuTe are systematically studied. Our results show that it possesses an ultralow lattice thermal conductivity value of nearly ∼0.13 W m K at 300 K, mainly attributed to its small phonon group velocity, large Grüneisen parameters, and strong phonon-phonon scattering. Furthermore, the intralayer opposite phonon vibrations greatly restrict the heat transport. Monolayer KCuTe shows an ideal direct band gap of ∼1.21 eV, and a high twofold degeneracy appearing at the point gives a high Seebeck coefficient of ∼2070 μV K, leading to high TE performance. Using the transport coefficients together with constant electron relaxation time, the figure of merit () can reach 2.71 at 700 K for the p-type doping, which is comparable to the well-known TE material SnSe (2.6 ± 0.3 at 935 K). Our theoretical studies may provide perspectives to TE applications of monolayer KCuTe and stimulate further experimental synthesis.
单层KCuTe是一种新型二维(2D)半导体材料,具有高载流子迁移率和大功率能量转换效率,表明其在热电(TE)和光电领域具有潜在应用。基于密度泛函理论(DFT)和半经典玻尔兹曼输运方程,系统研究了单层KCuTe的电子和声子输运性质。我们的结果表明,在300 K时它具有超低的晶格热导率值,接近~0.13 W m⁻¹ K⁻¹,这主要归因于其较小的声子群速度、较大的格林艾森参数和强烈的声子-声子散射。此外,层内相反的声子振动极大地限制了热传输。单层KCuTe显示出约1.21 eV的理想直接带隙,并且在Γ点出现的高二重简并性给出了约2070 μV K⁻¹的高塞贝克系数,从而导致高热电性能。对于p型掺杂,在700 K时使用输运系数和恒定的电子弛豫时间,优值(ZT)可以达到2.71,这与著名的热电材料SnSe(在935 K时为2.6±0.3)相当。我们的理论研究可能为单层KCuTe的热电应用提供思路,并刺激进一步的实验合成。