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具有优异热稳定性和机械性能的轻质柔性聚醚醚酮基复合薄膜,用于宽带电磁干扰屏蔽。

Light weight and flexible poly(ether ether ketone) based composite film with excellent thermal stability and mechanical properties for wide-band electromagnetic interference shielding.

作者信息

Na Ruiqi, Liu Jinying, Wang Guibin, Zhang Shuling

机构信息

National & Local Joint Engineering Laboratory for Synthesis Technology of High Performance Polymer, College of Chemistry, Jilin University Changchun 130012 P. R. China

Changchun Applied Chemistry Corporation Chinese Academy of Sciences Changchun 130012 P. R. China.

出版信息

RSC Adv. 2018 Jan 16;8(6):3296-3303. doi: 10.1039/c7ra11675f. eCollection 2018 Jan 12.

Abstract

This study proposes an efficient method for fabricating a light weight and flexible composite film with excellent thermal stability and mechanical properties for wide-band electromagnetic interference (EMI) shielding, which was prepared by melt blending and subsequent melt extrusion using poly(ether ether ketone) (PEEK) as a matrix, multi-walled carbon nanotube wrapped poly(ether sulfone) (wrapped MWCNTs) as a conductive filler, and GENIOPLAST® PELLET S (GPPS, high-temperature lubricant) as a processing aid. GPPS was firstly used in EMI application, to reduce the melt viscosity of PEEK as well as to improve the dispersion of wrapped MWCNTs, which enables it to fabricate a highly efficient EMI shielding (∼74.6 dB mm) PEEK/wrapped MWCNT/GPPS1.0 composite film with a thickness of 180 μm. Furthermore, the lightweight composite film exhibits high thermal stability ( degradation temperature at 5% mass loss of 586 °C) and good mechanical properties (tensile strength of 101 MPa), being superior to other previously reported EMI shielding films. The above mentioned enhanced property demonstrated its potential application as a high performance EMI shield for certain applications such as in the aerospace, weapons, and microelectronics industries, which require materials exhibits EMI shielding as well as superior mechanical properties and thermal stability.

摘要

本研究提出了一种高效的方法来制备一种轻质且柔性的复合薄膜,该薄膜具有优异的热稳定性和机械性能,用于宽带电磁干扰(EMI)屏蔽。它是通过以聚醚醚酮(PEEK)为基体、多壁碳纳米管包覆聚醚砜(包覆的多壁碳纳米管)为导电填料、GENIOPLAST® PELLET S(GPPS,高温润滑剂)为加工助剂进行熔融共混并随后熔融挤出制备而成的。GPPS首次应用于电磁干扰领域,用于降低PEEK的熔体粘度以及改善包覆的多壁碳纳米管的分散性,这使得能够制备出一种厚度为180μm、高效电磁干扰屏蔽(约74.6 dB·mm)的PEEK/包覆的多壁碳纳米管/GPPS1.0复合薄膜。此外,这种轻质复合薄膜具有高热稳定性(5%质量损失时的降解温度为586℃)和良好的机械性能(拉伸强度为101 MPa),优于其他先前报道的电磁干扰屏蔽薄膜。上述增强的性能表明其在某些应用中作为高性能电磁干扰屏蔽材料具有潜在应用价值,例如在航空航天、武器和微电子行业,这些行业要求材料具备电磁干扰屏蔽以及优异的机械性能和热稳定性。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e95c/9077580/ee1f6a647368/c7ra11675f-f1.jpg

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