El-Askary Farid, Hassanein Abdullah, Aboalazm Emad, Al-Haj Husain Nadin, Özcan Mutlu
Operative Dentistry Department, Faculty of Dentistry, Ain Shams University, Cairo 11566, Egypt.
Conservative Dentistry Department, Faculty of Oral and Dental Medicine, Egyptian-Russian University, Cairo 11829, Egypt.
Materials (Basel). 2022 Apr 22;15(9):3050. doi: 10.3390/ma15093050.
The aim of this study was to evaluate the effect of CAD/CAM composite thickness on micro-tensile bond strength (µTBS), microhardness (HV), and film thickness (FT) of different luting composites. Composite blocks (6.8 mm × 6.8 mm) were divided into 12 groups according to: CAD/CAM thickness and luting composite. For each group, 21 rods (1 mm × 1 mm) were tested in tension at crosshead speed of 1 mm/min. Fracture modes were categorized as adhesive, mixed, and cohesive. Microhardness (n = 5/group) was assessed using microhardness tester. Film thickness (12-rods/group) was evaluated using a stereomicroscope (×40). Data were analyzed using the two-way ANOVA/Tukey’s HSD test (p = 0.05). Parameters “thickness”, “cement”, and “thickness x cement” showed significant difference on µTBS and HV (p < 0.05). At 2 mm, heated x-tra fil composite showed the highest µTBS (45.0 ± 8.5 MPa), while at 4 mm thickness, Grandio Flow revealed the lowest µTBS (33.3 ± 6.3 MPa). Adhesive, mixed, and cohesive failures were reported. The HV of all composites decreased when photo-polymerized through 4 mm thickness (p < 0.05). Regardless of CAD/CAM thickness, photo-polymerized composites can be successfully used for luting CAD/CAM composite.
本研究的目的是评估CAD/CAM复合材料厚度对不同粘结性复合材料的微拉伸粘结强度（µTBS）、显微硬度（HV）和膜厚（FT）的影响。将复合块（6.8 mm×6.8 mm）根据CAD/CAM厚度和粘结性复合材料分为12组。对于每组，21根棒材（1 mm×1 mm）以1 mm/min的十字头速度进行拉伸测试。断裂模式分为粘结性、混合型和内聚性。使用显微硬度测试仪评估显微硬度（每组n = 5）。使用立体显微镜（×40）评估膜厚（每组12根棒材）。使用双向方差分析/图基氏 Honestly Significant Difference 检验（p = 0.05）分析数据。参数“厚度”、“粘结剂”和“厚度×粘结剂”在µTBS和HV上显示出显著差异（p < 0.05）。在2 mm时，加热的x-tra fil复合材料显示出最高的µTBS（45.0±8.5 MPa），而在4 mm厚度时，Grandio Flow显示出最低的µTBS（33.3±6.3 MPa）。报告了粘结性、混合型和内聚性破坏。当通过4 mm厚度光聚合时，所有复合材料的HV均降低（p < 0.05）。无论CAD/CAM厚度如何，光聚合复合材料均可成功用于粘结CAD/CAM复合材料。
