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薄膜存储器件中半导体-铁电聚合物复合材料纳米结构的系统控制

Systematic Control of the Nanostructure of Semiconducting-Ferroelectric Polymer Composites in Thin Film Memory Devices.

作者信息

Sung Seung Hyun, Boudouris Bryan W

机构信息

School of Chemical Engineering, Purdue University, 480 Stadium Mall Drive, West Lafayette, Indiana 47907, United States.

出版信息

ACS Macro Lett. 2015 Mar 17;4(3):293-297. doi: 10.1021/mz5007766. Epub 2015 Feb 16.

Abstract

In polymer-based ferroelectric diodes, films are composed of a semiconducting polymer and a ferroelectric polymer blend sandwiched between two metal electrodes. In these thin films, the ferroelectric phase serves as the memory retention medium while the semiconducting phase serves as the pathway to read-out the memory in a nondestructive manner. As such, having distinct phases for the semiconducting and ferroelectric phases have proven critical to device performance. In order to evaluate this crucial structure-property relationship, we have fabricated ordered ferroelectric devices (OFeDs) through common lithographic techniques to establish systematically the impact of nanoscale structure on the macroscopic performance. In particular, we demonstrate that there is an optimal domain size (∼400 nm) for the interpenetrating networks, and we show that the ordered device, with semiconducting domains that span the entire length of the active layer film, provides a significant increase in the ON/OFF ratio relative to the blended film fabricated using standard solution blending and spin-coating techniques. This improved performance occurs due to a combination of the ordered nanostructure and the nature of the ferroelectric-semiconductor interface. As this is the first demonstration of macroscopic OFeDs, this work helps to elucidate the underlying physics of the device operation and establishes a new archetype in the design of polymer-based, nonvolatile memory devices.

摘要

在基于聚合物的铁电二极管中,薄膜由夹在两个金属电极之间的半导体聚合物和铁电聚合物混合物组成。在这些薄膜中,铁电相作为记忆保持介质,而半导体相作为以无损方式读出记忆的途径。因此,半导体相和铁电相具有不同的相已被证明对器件性能至关重要。为了评估这种关键的结构-性能关系,我们通过常见的光刻技术制造了有序铁电器件(OFeDs),以系统地确定纳米级结构对宏观性能的影响。特别是,我们证明了互穿网络存在一个最佳畴尺寸(约400纳米),并且我们表明,具有跨越有源层薄膜整个长度的半导体畴的有序器件,相对于使用标准溶液混合和旋涂技术制造的混合薄膜,其开/关比有显著提高。这种性能的提升是由于有序纳米结构和铁电-半导体界面性质的共同作用。由于这是宏观OFeDs的首次展示,这项工作有助于阐明器件操作的潜在物理原理,并在基于聚合物的非易失性存储器件设计中建立一种新的原型。

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