Zhang Lu, Li Yan, Li Simeng, Gong Ping, Chen Qiaoyu, Geng Haoze, Sun Minxi, Sun Qinglei, Hao Liang
Gemmological Institute, China University of Geosciences, Wuhan 430074, China.
Hubei Gem & Jewelry Engineering Technology Research Center, Wuhan 430074, China.
Micromachines (Basel). 2022 Apr 30;13(5):724. doi: 10.3390/mi13050724.
The poor wettability and weak interfacial bonding of diamond/copper composites are due to the incompatibility between diamond and copper which are inorganic nonmetallic and metallic material, respectively, which limit their further application in next-generation heat management materials. Coating copper and titanium on the diamond particle surface could effectively modify and improve the wettability of the diamond/copper interface via electroless plating and evaporation methods, respectively. Here, these dense and complex composites were successfully three-dimensionally printed via selective laser melting. A high thermal conductivity (TC, 336 W/mK) was produced by 3D printing 1 vol.% copper-coated diamond/copper mixed powders at an energy density of 300 J/mm (laser power = 180 W and scanning rate = 200 mm/s). 1 and 3 vol.% copper-coated diamond/copper composites had lower coefficients of thermal expansions and higher TCs. They also had stronger bending strengths than the corresponding titanium-coated diamond/copper composites. The interface between copper matrix and diamond reinforcement was well bonded, and there was no cracking in the 1 vol.% copper-coated diamond/copper composite sample. The optimization of the printing parameters and strategy herein is beneficial to develop new approaches for the further construction of a wider range of micro-sized diamond particles reinforced metal matrix composites.
金刚石/铜复合材料的润湿性差和界面结合力弱是由于金刚石和铜分别为无机非金属材料和金属材料，两者不相容，这限制了它们在下一代热管理材料中的进一步应用。分别通过化学镀和蒸发法在金刚石颗粒表面包覆铜和钛，可有效改善和提高金刚石/铜界面的润湿性。在此，通过选择性激光熔化成功地对这些致密且复杂的复合材料进行了三维打印。通过以300 J/mm的能量密度（激光功率 = 180 W，扫描速度 = 200 mm/s）对1 vol.%的镀铜金刚石/铜混合粉末进行3D打印，获得了高导热率（TC，336 W/mK）。1 vol.%和3 vol.%的镀铜金刚石/铜复合材料具有较低的热膨胀系数和较高的导热率。它们的弯曲强度也比相应的镀钛金刚石/铜复合材料更强。铜基体与金刚石增强体之间的界面结合良好，1 vol.%的镀铜金刚石/铜复合材料样品中没有出现裂纹。本文中打印参数和策略的优化有利于开发新方法，进一步构建更广泛的微米级金刚石颗粒增强金属基复合材料。
