Li Yaqiang, Zhou Hongyu, Wu Chunjing, Yin Zheng, Liu Chang, Liu Junyou, Shi Zhongliang
Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China.
National Center for Materials Service Safety, University of Science and Technology Beijing, Beijing 100083, China.
Nanomaterials (Basel). 2023 Feb 26;13(5):878. doi: 10.3390/nano13050878.
Diamond/Cu composites are widely studied as a new generation of thermal management materials in the field of electronic packaging and heat sink materials. The surface modification of diamond can improve interfacial bonding between the diamond and Cu matrix. The Ti-coated diamond/Cu composites are prepared via an independently developed liquid-solid separation (LSS) technology. It is worth noting that there are obvious differences for the surface roughness between the diamond-{100} and -{111} face by AFM analysis, which may be related to the surface energy of different facets. In this work, the formation of titanium carbide (TiC) phase makes up the chemical incompatibility between the diamond and copper, and the thermal conductivities of 40 vol.% Ti-coated diamond/Cu composites can be improved to reach 457.22 W·m·K. The results estimated by the differential effective medium (DEM) model illustrate that the thermal conductivity for 40 vol.% Ti-coated diamond/Cu composites show a dramatic decline with increasing TiC layer thickness, giving a critical value of ~260 nm.
金刚石/铜复合材料作为电子封装和散热材料领域的新一代热管理材料受到广泛研究。金刚石的表面改性可以改善金刚石与铜基体之间的界面结合。通过自主研发的液固分离（LSS）技术制备了镀钛金刚石/铜复合材料。值得注意的是，通过原子力显微镜（AFM）分析，金刚石{100}面和{111}面之间的表面粗糙度存在明显差异，这可能与不同晶面的表面能有关。在这项工作中，碳化钛（TiC）相的形成弥补了金刚石与铜之间的化学不相容性，40体积%镀钛金刚石/铜复合材料的热导率可提高到457.22W·m·K。由微分有效介质（DEM）模型估算的结果表明，40体积%镀钛金刚石/铜复合材料的热导率随着TiC层厚度的增加而急剧下降，临界值约为260nm。
