Xu Qiang, Cao Xiaodie, Liu Yibo, Xu Yanjun, Wu Jiajun
Central Iron & Research Institute, Beijing 100081, China.
Beijing Gang Yan Diamond Products Company, Beijing 102200, China.
Materials (Basel). 2024 Jul 26;17(15):3711. doi: 10.3390/ma17153711.
Chromium-plated diamond/copper composite materials, with Cr layer thicknesses of 150 nm and 200 nm, were synthesized using a vacuum hot-press sintering process. Comparative analysis revealed that the thermal conductivity of the composite material with a Cr layer thickness of 150 nm increased by 266%, while that with a Cr layer thickness of 200 nm increased by 242%, relative to the diamond/copper composite materials without Cr plating. This indicates that the introduction of the Cr layer significantly enhanced the thermal conductivity of the composite material. The thermal properties of the composite material initially increased and subsequently decreased with rising sintering temperature. At a sintering temperature of 1050 °C and a diamond particle size of 210 μm, the thermal conductivity of the chromium-plated diamond/copper composite material reached a maximum value of 593.67 W∙m∙K. This high thermal conductivity is attributed to the formation of chromium carbide at the interface. Additionally, the surface of the diamond particles in contact with the carbide layer exhibited a continuous serrated morphology due to the interface reaction. This "pinning effect" at the interface strengthened the bonding between the diamond particles and the copper matrix, thereby enhancing the overall thermal conductivity of the composite material.
采用真空热压烧结工艺合成了铬层厚度为150纳米和200纳米的镀铬金刚石/铜复合材料。对比分析表明，与未镀铬的金刚石/铜复合材料相比，铬层厚度为150纳米的复合材料的热导率提高了266%，而铬层厚度为200纳米的复合材料的热导率提高了242%。这表明铬层的引入显著提高了复合材料的热导率。复合材料的热性能最初随烧结温度的升高而增加，随后下降。在烧结温度为1050℃、金刚石粒径为210μm时，镀铬金刚石/铜复合材料的热导率达到最大值593.67W∙m∙K。这种高的热导率归因于界面处碳化铬的形成。此外，由于界面反应，与碳化物层接触处的金刚石颗粒表面呈现出连续的锯齿状形态。界面处的这种“钉扎效应”加强了金刚石颗粒与铜基体之间的结合，从而提高了复合材料的整体热导率。
