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界面配位相互作用赋予软质弹性体复合材料高导热性和高韧性。

Interfacial Coordination Interaction Enables Soft Elastomer Composites High Thermal Conductivity and High Toughness.

作者信息

He Dongyi, Wang Zhenyu, Zeng Xiangliang, Fan Jianfeng, Ren Linlin, Du Guoping, Sun Rong, Zeng Xiaoliang

机构信息

School of Physics and Materials Science, Nanchang University, Nanchang 330031, China.

Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China.

出版信息

ACS Appl Mater Interfaces. 2022 Jul 27;14(29):33912-33921. doi: 10.1021/acsami.2c09761. Epub 2022 Jul 18.

Abstract

Soft elastomers have attracted wide applications, such as soft electronic devices and soft robotics, due to their ability to undergo large deformation with a small external force. Most elastomers suffer from poor toughness and thermal conductivity, which limits their use. The addition of inorganic fillers can enhance the thermal conductivity and toughness, but it deteriorates the softness (low Young's modulus and high stretchability). Integrating thermal conductivity, toughness, and softness into one elastomer is still a challenge. Here, we report a strategy of interfacial coordination interaction to achieve soft elastomer composites with high thermal conductivity and high toughness. We demonstrate the strategy by using poly(lipoic acid) elastomer and silver-coated aluminum filler as model, where silver-sulfur coordination cross-links are formed at the interface. The resultant elastomer composite shows high streachability (450%), high thermal conductivity (2.35 W m K), low modulus (321 kPa), and high toughness (3496 J m), which cannot be achieve in existing elastomers. The time domain thermoreflectance technique demonstrates that the silver-sulfur coordination interaction lowers the interfacial thermal resistance, resulting in enhanced thermal conductivity of the elastomer composites. The excellent softness stems from lower bonding energy of the silver-sulfur coordination cross-links compared with covalent chemical cross-links. The high toughness also benefits from the interfacial silver-sulfur coordination interaction that can dissipate more energy upon deformation. We further demonstrate the potential application of the thermally conductive, tough, and soft elastomer composites for thermal management of chip and soft electronic devices.

摘要

软弹性体因其能够在较小外力作用下发生大变形而在软电子器件和软体机器人等领域得到了广泛应用。大多数弹性体的韧性和热导率较差,这限制了它们的使用。添加无机填料可以提高热导率和韧性,但会降低柔软度(低杨氏模量和高拉伸性)。将热导率、韧性和柔软度集成到一种弹性体中仍然是一个挑战。在此,我们报道了一种界面配位相互作用策略,以实现具有高导热率和高韧性的软弹性体复合材料。我们以聚硫辛酸弹性体和镀银铝填料为模型展示了该策略,其中在界面处形成了银 - 硫配位交联。所得的弹性体复合材料具有高拉伸性(450%)、高导热率(2.35 W m⁻¹ K⁻¹)、低模量(321 kPa)和高韧性(3496 J m⁻²),这是现有弹性体无法实现的。时域热反射技术表明,银 - 硫配位相互作用降低了界面热阻,从而提高了弹性体复合材料的热导率。优异的柔软度源于银 - 硫配位交联的键能比共价化学交联低。高韧性也得益于界面银 - 硫配位相互作用,该作用在变形时能够耗散更多能量。我们进一步展示了这种导热、坚韧且柔软的弹性体复合材料在芯片和软电子器件热管理方面的潜在应用。

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