Department of Operative Dentistry and Endodontics, Faculty of Dentistry, Mahidol University, Ratchathewi District, No. 6, Yothi Road, Bangkok, 10400, Thailand.
Department of Restorative Dentistry, Graduate School of Dental Medicine, Hokkaido University, Sapporo, Japan.
Clin Oral Investig. 2022 Nov;26(11):6743-6752. doi: 10.1007/s00784-022-04634-3. Epub 2022 Jul 25.
To evaluate the effect of a time delay before the light activation of resin composite on the microtensile bond strength (µTBS) of self-etch adhesives under dynamic simulated pulpal pressure.
One hundred twenty crown segments were prepared from human third molars. Dentin surfaces were prepared with coarse diamond burs and connected to a dynamic pulpal pressure device. The self-etch adhesives used were Clearfil SE Bond (CSE), G2-Bond Universal (G2B), Clearfil Universal Bond Quick (CBQ), and G-Premio Bond (GPB). Each adhesive was divided into 3 subgroups: immediate light activation of resin composite (T), delayed light activation for 150 s (T), and 300 s (T). The µTBS data were obtained after 24-h water storage. Scanning electron microscopy was used to evaluate the nanoleakage at the resin-dentin surface. The µTBS data were analyzed using two-way ANOVA and Duncan's multiple comparisons.
All adhesives demonstrated a significant reduction in µTBS at T, except for CBQ where the bond strength was not affected by the delayed light activation times. The two-step self-etch adhesives (CSE and G2B) demonstrated higher bond strength than the one-step adhesives at all conditions. Nanoleakage was observed in all adhesives at T; however, nanoleakage was detected only in CBQ and GPB at T.
Delayed light activation of resin composite adversely affected the dentin bond strength of self-etch adhesives. Two-step self-etch adhesives had better bonding performance than one-step self-etch adhesives.
After adhesive application, resin composite should be adapted and cured as soon as possible.
评估光激活树脂复合材料前的时间延迟对动态模拟牙髓压力下自酸蚀粘结剂的微拉伸粘结强度（µTBS）的影响。
从人第三磨牙制备 120 个牙冠段。用粗金刚石车针制备牙本质表面，并连接到动态牙髓压力装置。使用的自酸蚀粘结剂为 Clearfil SE Bond（CSE）、G2-Bond Universal（G2B）、Clearfil Universal Bond Quick（CBQ）和 G-Premio Bond（GPB）。每种粘结剂分为 3 个亚组：树脂复合材料的即时光激活（T）、延迟 150 s 光激活（T）和 300 s 光激活（T）。在 24 小时水储存后获得 µTBS 数据。扫描电子显微镜用于评估树脂-牙本质表面的纳米渗漏。使用双向方差分析和 Duncan 多重比较分析 µTBS 数据。
除 CBQ 外，所有粘结剂在 T 时µTBS 均显著降低，而 CBQ 中的粘结强度不受延迟光激活时间的影响。两步自酸蚀粘结剂（CSE 和 G2B）在所有条件下均表现出比一步自酸蚀粘结剂更高的粘结强度。在 T 时所有粘结剂均观察到纳米渗漏；然而，仅在 T 时在 CBQ 和 GPB 中检测到纳米渗漏。
光激活树脂复合材料的延迟会对自酸蚀粘结剂的牙本质粘结强度产生不利影响。两步自酸蚀粘结剂的粘结性能优于一步自酸蚀粘结剂。
粘结剂应用后，应尽快适应和固化树脂复合材料。
