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用于光通信的飞秒激光制造光子芯片:综述

Femtosecond Laser-Fabricated Photonic Chips for Optical Communications: A Review.

作者信息

Cai Chengkun, Wang Jian

机构信息

Wuhan National Laboratory for Optoelectronics, School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan 430074, China.

Optics Valley Laboratory, Wuhan 430074, China.

出版信息

Micromachines (Basel). 2022 Apr 16;13(4):630. doi: 10.3390/mi13040630.

Abstract

Integrated optics, having the unique properties of small size, low loss, high integration, and high scalability, is attracting considerable attention and has found many applications in optical communications, fulfilling the requirements for the ever-growing information rate and complexity in modern optical communication systems. Femtosecond laser fabrication is an acknowledged technique for producing integrated photonic devices with unique features, such as three-dimensional fabrication geometry, rapid prototyping, and single-step fabrication. Thus, plenty of femtosecond laser-fabricated on-chip devices have been manufactured to realize various optical communication functions, such as laser generation, laser amplification, laser modulation, frequency conversion, multi-dimensional multiplexing, and photonic wire bonding. In this paper, we review some of the most relevant research progress in femtosecond laser-fabricated photonic chips for optical communications, which may break new ground in this area. First, the basic principle of femtosecond laser fabrication and different types of laser-inscribed waveguides are briefly introduced. The devices are organized into two categories: active devices and passive devices. In the former category, waveguide lasers, amplifiers, electric-optic modulators, and frequency converters are reviewed, while in the latter, polarization multiplexers, mode multiplexers, and fan-in/fan-out devices are discussed. Later, photonic wire bonding is also introduced. Finally, conclusions and prospects in this field are also discussed.

摘要

集成光学具有尺寸小、损耗低、集成度高和可扩展性强等独特特性,正吸引着广泛关注,并已在光通信领域得到诸多应用,满足了现代光通信系统中对不断增长的信息速率和复杂性的要求。飞秒激光加工是一种公认的用于制造具有独特特性的集成光子器件的技术,例如三维加工几何形状、快速原型制作和单步加工。因此,大量通过飞秒激光制造的片上器件已被制造出来,以实现各种光通信功能,如激光产生、激光放大、激光调制、频率转换、多维复用和光子引线键合。在本文中,我们回顾了飞秒激光制造的用于光通信的光子芯片的一些最相关的研究进展,这可能会在该领域开辟新的天地。首先,简要介绍了飞秒激光加工的基本原理以及不同类型的激光写入波导。这些器件分为两类:有源器件和无源器件。在前一类中,回顾了波导激光器、放大器、电光调制器和频率转换器,而在后一类中,讨论了偏振复用器、模式复用器和扇入/扇出器件。随后,还介绍了光子引线键合。最后,也讨论了该领域的结论和前景。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/91cf/9024536/dd2c1ab947e0/micromachines-13-00630-g001.jpg

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