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直接测定宽带隙半导体中缺陷的带隙

Direct Determination of Band Gap of Defects in a Wide Band Gap Semiconductor.

作者信息

Yan Xuexi, Jin Qianqian, Jiang Yixiao, Yao Tingting, Li Xiang, Tao Ang, Gao Chunyang, Chen Chunlin, Ma Xiuliang, Ye Hengqiang

机构信息

Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, School of Material Science and Engineering, University of Science and Technology of China, Shenyang 110016, China.

Jihua Lab, Foshan 528251, China.

出版信息

ACS Appl Mater Interfaces. 2022 Aug 17;14(32):36875-36881. doi: 10.1021/acsami.2c10143. Epub 2022 Aug 4.

Abstract

Crystal defects play an important role in the degradation and failure of semiconductor materials and devices. Direct determination of band gap of defects is a critical step for clarifying how the defects affect the physical properties of semiconductors. Here, high-quality aluminum nitride (AlN) thin films were grown epitaxially on single-crystal AlO substrates via pulsed laser deposition. The atomic structure and band gap of three types of inversion domain boundaries (IDBs) in AlN were determined using aberration-corrected transmission electron microscopy and atomic-resolution valence electron energy-loss spectroscopy. It was found that the band gap of all of the IDBs reduces evidently compared to that of the bulk AlN. The maximum band gap reduction of the IDBs is 1.0 eV. First-principles calculations revealed that the band gap reduction of the IDBs is mainly due to the rise of p orbital at the valence band maximum, which originates from the elongated Al-N bonds along the [0001] direction at the IDBs. The successful band gap determination of defects paves an avenue for quantitatively evaluating the effect of defects on the performance of semiconductor materials and devices.

摘要

晶体缺陷在半导体材料和器件的退化及失效过程中起着重要作用。直接测定缺陷的带隙是阐明缺陷如何影响半导体物理性质的关键步骤。在此,通过脉冲激光沉积在单晶AlO衬底上外延生长了高质量的氮化铝(AlN)薄膜。利用像差校正透射电子显微镜和原子分辨率价电子能量损失谱确定了AlN中三种类型的反演畴界(IDB)的原子结构和带隙。结果发现,与块状AlN相比,所有IDB的带隙都明显减小。IDB的最大带隙减小量为1.0 eV。第一性原理计算表明,IDB的带隙减小主要是由于价带最大值处p轨道的上升,这源于IDB处沿[0001]方向伸长的Al-N键。成功测定缺陷的带隙为定量评估缺陷对半导体材料和器件性能的影响铺平了道路。

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