Cruz Alfonso C, Hernández Luis S, Gutiérrez Emmanuel J
Volta Plating / American Springs, Carretera al Verde, 1494-B El Salto, Jalisco Mexico.
Instituto de Metalurgia, Universidad Autónoma de San Luis Potosí, Av. Sierra Leona N° 550, Lomas 2a Sección, 78210 San Luis Potosí, Mexico.
J Mater Eng Perform. 2023;32(5):2432-2444. doi: 10.1007/s11665-022-07270-w. Epub 2022 Sep 1.
This work deals with the development of cyanide-free copper-silver electroplated coatings on AISI-1075 steel and its corrosion behavior under a 5% NaClO solution (commercial household bleach). A cyanide-free bath based on sodium thiosulfate was employed to obtain the silver coatings using current densities from 0.2 to 5.0 mA/cm and different concentrations of EDTA (additive). The evolution of the open circuit potential with time showed that silver is anodic with respect to copper, so there were no intense attacks in the silver pores. Adhesion measurements were made on both coatings by the tape test. The behavior against corrosion was evaluated by polarization resistance (Rp) in samples with the best coating adhesion. The best results were obtained with a silver coating of about 20 μm in thickness deposited on copper coating previously polished with colloidal silica. The best performance was attributed to the formation of AgCl as demonstrated by x-ray diffraction and scanning electron microscopy.
本工作研究了在AISI - 1075钢上无氰铜 - 银电镀涂层的开发及其在5%次氯酸钠溶液(市售家用漂白剂)中的腐蚀行为。采用基于硫代硫酸钠的无氰镀液,使用0.2至5.0 mA/cm的电流密度和不同浓度的EDTA(添加剂)来获得银涂层。开路电位随时间的变化表明,相对于铜,银是阳极,因此银孔隙中没有强烈的侵蚀。通过胶带试验对两种涂层进行附着力测量。在涂层附着力最佳的样品中,通过极化电阻(Rp)评估其耐腐蚀性能。在先前用胶体二氧化硅抛光的铜涂层上沉积约20μm厚的银涂层时获得了最佳结果。如X射线衍射和扫描电子显微镜所示,最佳性能归因于AgCl的形成。