Suppr超能文献

用于太赫兹集成系统的(001)GaAs衬底上的BiSe生长

BiSe Growth on (001) GaAs Substrates for Terahertz Integrated Systems.

作者信息

Liu Yongchen, Acuna Wilder, Zhang Huairuo, Ho Dai Q, Hu Ruiqi, Wang Zhengtianye, Janotti Anderson, Bryant Garnett, Davydov Albert V, Zide Joshua M O, Law Stephanie

机构信息

Department of Materials Science and Engineering, University of Delaware, Newark, Delaware 19716, United States.

Materials Science and Engineering Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, United States.

出版信息

ACS Appl Mater Interfaces. 2022 Sep 21;14(37):42683-42691. doi: 10.1021/acsami.2c11135. Epub 2022 Sep 8.

Abstract

Terahertz (THz) technologies have been of interest for many years due to the variety of applications including gas sensing, nonionizing imaging of biological systems, security and defense, and so forth. To date, scientists have used different classes of materials to perform different THz functions. However, to assemble an on-chip THz integrated system, we must understand how to integrate these different materials. Here, we explore the growth of BiSe, a topological insulator material that could serve as a plasmonic waveguide in THz integrated devices, on technologically important GaAs(001) substrates. We explore surface treatments and find that an atomically smooth GaAs surface is critical to achieving high-quality BiSe films despite the relatively weak film/substrate interaction. Calculations indicate that the BiSe/GaAs interface is likely selenium-terminated and shows no evidence of chemical bonding between the BiSe and the substrate. These results are a guide for integrating van der Waals materials with conventional semiconductor substrates and serve as the first steps toward achieving an on-chip THz integrated system.

摘要

太赫兹(THz)技术因其在气体传感、生物系统的非电离成像、安全与国防等众多应用领域而受到关注多年。迄今为止,科学家们已使用不同种类的材料来实现不同的太赫兹功能。然而,要组装一个片上太赫兹集成系统,我们必须了解如何整合这些不同的材料。在此,我们探索了拓扑绝缘体材料BiSe在技术上重要的GaAs(001)衬底上的生长情况,BiSe可作为太赫兹集成器件中的等离子体波导。我们研究了表面处理方法,发现尽管薄膜/衬底相互作用相对较弱,但原子级光滑的GaAs表面对于获得高质量的BiSe薄膜至关重要。计算表明,BiSe/GaAs界面可能以硒为终端,且没有证据表明BiSe与衬底之间存在化学键合。这些结果为将范德华材料与传统半导体衬底集成提供了指导,并朝着实现片上太赫兹集成系统迈出了第一步。

文献检索

告别复杂PubMed语法,用中文像聊天一样搜索,搜遍4000万医学文献。AI智能推荐,让科研检索更轻松。

立即免费搜索

文件翻译

保留排版,准确专业,支持PDF/Word/PPT等文件格式,支持 12+语言互译。

免费翻译文档

深度研究

AI帮你快速写综述,25分钟生成高质量综述,智能提取关键信息,辅助科研写作。

立即免费体验