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回收废弃非金属印刷电路板用于聚氯乙烯复合材料

Recycling Waste Nonmetallic Printed Circuit Boards for Polyvinyl Chloride Composites.

作者信息

Moe Aung Kyaw, Chungprempree Jirasuta, Preechawong Jitima, Sapsrithong Pornsri, Nithitanakul Manit

机构信息

The Petroleum and Petrochemical College, Chulalongkorn University, Bangkok 10330, Thailand.

Center of Excellence on Petrochemical and Materials Technology, Bangkok 10330, Thailand.

出版信息

Polymers (Basel). 2022 Aug 28;14(17):3531. doi: 10.3390/polym14173531.

Abstract

To reduce environmental threats, such as land filling, incineration and soil pollution, which are associated with the improper waste management of waste printed circuit boards, the utilization of NMPCBs from waste PCBs as a filler in composites was pursued. Untreated and treated NMPCBs in varying ratios, 10-30 wt.%, were blended with PVC to produce NMPCB/PVC composites, using the melt-mixing method via an internal mixer, in order to solve the remaining NMPCB waste problem after the valuable metals in PCBs were recovered. The incorporation of the NMPCB with PVC resulted in an increase in the tensile modulus and the thermal stability of the resulting composites. Scanning electron microscopy (SEM) results indicated improved interfacial adhesion between the treated NMPCB and the PVC matrix. The FTIR results of the NMPCB treated with 3-glycidyloxypropyltrimethoxysilane (GPTMS) revealed the formation of Si-O-Si bonds. The densities of the composites were found to increase with an increase in the content of the treated NMPCB, and compatibility improved. The tensile properties of the treated NMPCB/PVC composites were higher than those of the untreated NMPCB/PVC composites, suggesting improved compatibility between the treated NMPCB and PVC. The PVC composite with 10 wt.% of the treated NMPCB showed the optimum tensile properties. It was observed that the tensile modulus of the treated NMPCB/PVC composite increased by 47.65% when compared to that of the neat PVC. The maximum thermal degradation temperature was 27 °C higher than that of the neat PVC. Dynamic mechanical analysis results also support the improved interfacial adhesion as a result of the improvement in the storage modulus at the glassy region, and the loss factor (tan δ) peak shifted to a higher temperature range than that of the PVC and the untreated NMPCB/PVC composite. These studies reveal that the NMPCB was successfully modified with 1 wt.% of GPTMS, which promoted the dispersion and interfacial adhesion in the PVC matrix, resulting in better tensile properties and better thermal stability of the PVC composite.

摘要

为减少与废弃印刷电路板废物管理不当相关的环境威胁,如填埋、焚烧和土壤污染,人们致力于将废弃印刷电路板中的非金属粉末作为复合材料的填料加以利用。将未经处理和经过处理的不同比例(10 - 30重量%)的非金属粉末与聚氯乙烯(PVC)混合,通过密炼机采用熔融混合法制备非金属粉末/聚氯乙烯复合材料,以解决印刷电路板中贵重金属回收后剩余的非金属粉末废物问题。将非金属粉末与聚氯乙烯混合后,所得复合材料的拉伸模量和热稳定性有所提高。扫描电子显微镜(SEM)结果表明,经过处理的非金属粉末与聚氯乙烯基体之间的界面附着力得到改善。用3 - 缩水甘油醚氧基丙基三甲氧基硅烷(GPTMS)处理后的非金属粉末的傅里叶变换红外光谱(FTIR)结果显示形成了硅氧硅键。发现复合材料的密度随着经过处理的非金属粉末含量的增加而增大,相容性得到改善。经过处理的非金属粉末/聚氯乙烯复合材料的拉伸性能高于未经处理的非金属粉末/聚氯乙烯复合材料,表明经过处理的非金属粉末与聚氯乙烯之间的相容性得到改善。含有10重量%经过处理的非金属粉末的聚氯乙烯复合材料表现出最佳的拉伸性能。据观察,与纯聚氯乙烯相比,经过处理的非金属粉末/聚氯乙烯复合材料的拉伸模量提高了47.65%。最大热降解温度比纯聚氯乙烯高27℃。动态力学分析结果也支持了由于玻璃态区域储能模量的提高而导致界面附着力得到改善,损耗因子(tanδ)峰向比聚氯乙烯和未经处理的非金属粉末/聚氯乙烯复合材料更高的温度范围移动。这些研究表明,用1重量%的GPTMS成功地对非金属粉末进行了改性,促进了其在聚氯乙烯基体中的分散和界面附着力,从而使聚氯乙烯复合材料具有更好的拉伸性能和热稳定性。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/88fe/9460210/2672d82e6fd1/polymers-14-03531-g001.jpg

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