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高迁移率族蛋白B1是铜死亡相关无菌性炎症的介质。

HMGB1 is a mediator of cuproptosis-related sterile inflammation.

作者信息

Liu Jiao, Liu Yang, Wang Yuan, Kang Rui, Tang Daolin

机构信息

DAMP Laboratory, Third Affiliated Hospital of Guangzhou Medical University, Guangzhou, Guangdong, China.

Department of Surgery, UT Southwestern Medical Center, Dallas, TX, United States.

出版信息

Front Cell Dev Biol. 2022 Sep 21;10:996307. doi: 10.3389/fcell.2022.996307. eCollection 2022.

Abstract

Cuproptosis is a recently recognized modality of cell death driven by intracellular copper-dependent mitochondrial stress. However, the mediators of the sterile inflammatory response to cuproptotic death are undetermined. Here, we report that high-mobility group box 1 (HMGB1), a damage-associated molecular pattern, is released by cuproptotic cells to initiate inflammation. Mechanically, copper accumulation-induced adenosine triphosphate (ATP) depletion activates AMP-activated protein kinase (AMPK) to promote HMGB1 phosphorylation, resulting in increased extracellular release. In contrast, genetic (using RNAi) or pharmacologic (using dorsomorphin) inhibition of AMPK activation limits cuproptosis and HMGB1 release. Functionally, the ability of HMGB1-deficient cuproptotic cells to promote advanced glycosylation end product-specific receptor (AGER, also known as RAGE)-dependent inflammatory cytokine production is greatly reduced. Thus, HMGB1 is a key immune mediator of cuproptosis-initiated sterile inflammation.

摘要

铜死亡是一种最近才被认识到的由细胞内铜依赖性线粒体应激驱动的细胞死亡方式。然而,对铜死亡引发的无菌性炎症反应的介质尚未确定。在此,我们报告高迁移率族蛋白B1(HMGB1),一种损伤相关分子模式,由铜死亡细胞释放以引发炎症。从机制上讲,铜积累诱导的三磷酸腺苷(ATP)耗竭激活腺苷酸活化蛋白激酶(AMPK)以促进HMGB1磷酸化,导致细胞外释放增加。相反,基因(使用RNA干扰)或药理学(使用 dorsomorphin)抑制AMPK激活会限制铜死亡和HMGB1释放。在功能上,缺乏HMGB1的铜死亡细胞促进晚期糖基化终产物特异性受体(AGER,也称为RAGE)依赖性炎性细胞因子产生的能力大大降低。因此,HMGB1是铜死亡引发的无菌性炎症的关键免疫介质。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e7f9/9534480/fa7e049e1182/fcell-10-996307-g001.jpg

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