A full-color micro-display via bonding of a InGaN blue/green dual-wavelength light-emitting diode (LED) array and a AlGaInP red LED array is demonstrated. The micro-display has a 120 µm pixel pitch, and each pixel consists of 40 µm × 120 µm red/green/blue (R/G/B) subpixels. The red LED array was integrated with the blue/green dual-wavelength LED array by Au/In flip-chip bonding to achieve full-color emission. Full-color images presented by the micro-display have high brightness and a wide color gamut. This heterogeneous integration technology using conventional LED materials shows the feasibility of a cost-effective approach for reliable high-performance full-color LED micro-displays in virtual reality (VR) and augmented reality (AR) devices.