Cai Zewei, Thirunavukkarasu Naveen, Diao Xuefeng, Wang Haoran, Wu Lixin, Zhang Chen, Wang Jianlei
College of Chemistry, Fuzhou University, Fuzhou 350116, China.
CAS Haixi Industrial Technology Innovation Center in Beilun, Ningbo 315830, China.
Polymers (Basel). 2022 Oct 13;14(20):4297. doi: 10.3390/polym14204297.
With the miniaturization and integration of electronic products, the heat dissipation efficiency of electronic equipment needs to be further improved. Notably, polymer materials are a choice for electronic equipment matrices because of their advantages of low cost and wide application availability. However, the thermal conductivity of polymers is insufficient to meet heat dissipation requirements, and their improvements remain challenging. For decades, as an efficient manufacturing technology, additive manufacturing has gradually attracted public attention, and researchers have also used this technology to produce new thermally conductive polymer materials. Here, we review the recent research progress of different 3D printing technologies in heat conduction and the thermal conduction mechanism of polymer matrix composites. Based on the classification of fillers, the research progress of thermally conductive materials prepared by fused filament fabrication (FFF) is discussed. It analyzes the internal relationship between FFF process parameters and the thermal conductivity of polymer matrix composites. Finally, this study summarizes the application and future development direction of thermally conductive composites by FFF.
随着电子产品的小型化和集成化，电子设备的散热效率需要进一步提高。值得注意的是，聚合物材料因其成本低和应用广泛的优点而成为电子设备基体的一种选择。然而，聚合物的热导率不足以满足散热要求，对其进行改进仍然具有挑战性。几十年来，作为一种高效的制造技术，增材制造逐渐引起了公众的关注，研究人员也利用这项技术生产新型导热聚合物材料。在此，我们综述了不同3D打印技术在热传导方面的最新研究进展以及聚合物基复合材料的热传导机理。基于填料的分类，讨论了熔融长丝制造（FFF）制备导热材料的研究进展。分析了FFF工艺参数与聚合物基复合材料热导率之间的内在关系。最后，本研究总结了FFF导热复合材料的应用及未来发展方向。
