Liu Bohai, Zhou Yu, Dong Lan, Lu Qinghua, Xu Xiangfan
Center for Phononics and Thermal Energy Science, China-EU Joint Center for Nanophononics, School of Physics Science and Engineering, Tongji University, Shanghai 200092, China.
School of Chemical Science and Technology, Tongji University, Shanghai 200092, China.
iScience. 2022 Oct 28;25(11):105451. doi: 10.1016/j.isci.2022.105451. eCollection 2022 Nov 18.
From flexible electronics and multifunctional textiles to artificial tissues, polymers penetrate nearly every aspect of modern technology. High thermal conductivity of polymers is often required in their applications, where heat dissipation is crucial to maintain product reliability and functionality. However, the intrinsic thermal conductivity of bulk polymers is largely hindered by the randomly coiled and entangled chain conformation. Here, we report a copolymerization strategy that can simultaneously manipulate the intrachain and interchain hopping and increase the thermal conductivity of linear copolymerized polyimide (PI) to three times higher than that of pure PI at a low-level introduction of 2,4,5,7-tetraamino-1,8-dihydroxyanthracene-9,10-dione (10%). In addition, the large-scale copolymerized PI films display thermal stability after annealing. These remarkable results allow bulk PI to be a potential candidate for thermal management, and this copolymerization method may benefit future synthesis of interfacial thermal materials.
从柔性电子器件、多功能纺织品到人造组织，聚合物几乎渗透到现代技术的各个方面。在聚合物的应用中，通常需要高导热性，因为散热对于维持产品的可靠性和功能性至关重要。然而，块状聚合物的固有热导率在很大程度上受到随机卷曲和缠结的链构象的阻碍。在此，我们报道了一种共聚策略，该策略可以同时控制链内和链间跳跃，并在低水平引入2,4,5,7-四氨基-1,8-二羟基蒽醌-9,10-二酮（10%）时，将线性共聚聚酰亚胺（PI）的热导率提高到比纯PI高三倍。此外，大规模共聚的PI薄膜在退火后表现出热稳定性。这些显著的结果使块状PI成为热管理的潜在候选材料，这种共聚方法可能有利于未来界面热材料的合成。
