Xu Yanfei, Wang Xiaoxue, Zhou Jiawei, Song Bai, Jiang Zhang, Lee Elizabeth M Y, Huberman Samuel, Gleason Karen K, Chen Gang
Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
Department of Chemical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
Sci Adv. 2018 Mar 30;4(3):eaar3031. doi: 10.1126/sciadv.aar3031. eCollection 2018 Mar.
Traditional polymers are both electrically and thermally insulating. The development of electrically conductive polymers has led to novel applications such as flexible displays, solar cells, and wearable biosensors. As in the case of electrically conductive polymers, the development of polymers with high thermal conductivity would open up a range of applications in next-generation electronic, optoelectronic, and energy devices. Current research has so far been limited to engineering polymers either by strong intramolecular interactions, which enable efficient phonon transport along the polymer chains, or by strong intermolecular interactions, which enable efficient phonon transport between the polymer chains. However, it has not been possible until now to engineer both interactions simultaneously. We report the first realization of high thermal conductivity in the thin film of a conjugated polymer, poly(3-hexylthiophene), via bottom-up oxidative chemical vapor deposition (oCVD), taking advantage of both strong C=C covalent bonding along the extended polymer chain and strong π-π stacking noncovalent interactions between chains. We confirm the presence of both types of interactions by systematic structural characterization, achieving a near-room temperature thermal conductivity of 2.2 W/m·K, which is 10 times higher than that of conventional polymers. With the solvent-free oCVD technique, it is now possible to grow polymer films conformally on a variety of substrates as lightweight, flexible heat conductors that are also electrically insulating and resistant to corrosion.
传统聚合物兼具电绝缘性和热绝缘性。导电聚合物的发展催生了诸如柔性显示器、太阳能电池和可穿戴生物传感器等新型应用。与导电聚合物的情况类似,具有高导热性的聚合物的发展将为下一代电子、光电子和能量设备带来一系列应用。目前的研究仅限于通过强分子内相互作用(使声子能够沿着聚合物链高效传输)或强分子间相互作用(使声子能够在聚合物链之间高效传输)来设计工程聚合物。然而,到目前为止还无法同时设计这两种相互作用。我们报告了通过自下而上的氧化化学气相沉积(oCVD),利用沿延伸聚合物链的强C=C共价键和链间强π-π堆积非共价相互作用,首次在共轭聚合物聚(3-己基噻吩)薄膜中实现了高导热性。我们通过系统的结构表征证实了这两种相互作用的存在,实现了接近室温的2.2 W/m·K的热导率,这比传统聚合物高出10倍。借助无溶剂oCVD技术,现在可以在各种基板上共形生长聚合物薄膜,作为轻质、柔性的热导体,同时还具有电绝缘性和抗腐蚀性。