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自改性纳米界面驱动超高双向热导率的氮化硼基复合柔性薄膜

Self-Modifying Nanointerface Driving Ultrahigh Bidirectional Thermal Conductivity Boron Nitride-Based Composite Flexible Films.

作者信息

Huang Taoqing, Zhang Xinyu, Wang Tian, Zhang Honggang, Li Yongwei, Bao Hua, Chen Min, Wu Limin

机构信息

Department of Materials Science and State Key Laboratory of Molecular Engineering of Polymers, Fudan University, Shanghai, 200433, People's Republic of China.

Department of Physics, University of Michigan-Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai, 200240, People's Republic of China.

出版信息

Nanomicro Lett. 2022 Nov 28;15(1):2. doi: 10.1007/s40820-022-00972-9.

Abstract

While boron nitride (BN) is widely recognized as the most promising thermally conductive filler for rapidly developing high-power electronic devices due to its excellent thermal conductivity and dielectric properties, a great challenge is the poor vertical thermal conductivity when embedded in composites owing to the poor interfacial interaction causing severe phonon scattering. Here, we report a novel surface modification strategy called the "self-modified nanointerface" using BN nanocrystals (BNNCs) to efficiently link the interface between BN and the polymer matrix. Combining with ice-press assembly method, an only 25 wt% BN-embedded composite film can not only possess an in-plane thermal conductivity of 20.3 W m K but also, more importantly, achieve a through-plane thermal conductivity as high as 21.3 W m K, which is more than twice the reported maximum due to the ideal phonon spectrum matching between BNNCs and BN fillers, the strong interaction between the self-modified fillers and polymer matrix, as well as ladder-structured BN skeleton. The excellent thermal conductivity has been verified by theoretical calculations and the heat dissipation of a CPU. This study provides an innovative design principle to tailor composite interfaces and opens up a new path to develop high-performance composites.

摘要

虽然氮化硼(BN)因其优异的热导率和介电性能而被广泛认为是快速发展的高功率电子器件中最有前途的导热填料,但由于界面相互作用差导致严重的声子散射,当将其嵌入复合材料中时,垂直热导率较差是一个巨大挑战。在此,我们报道了一种使用BN纳米晶体(BNNCs)的新型表面改性策略,即“自改性纳米界面”,以有效连接BN与聚合物基体之间的界面。结合冰压组装方法,仅含25 wt% BN的复合薄膜不仅面内热导率可达20.3 W m⁻¹ K⁻¹,更重要的是,其垂直热导率高达21.3 W m⁻¹ K⁻¹,由于BNNCs与BN填料之间理想的声子谱匹配、自改性填料与聚合物基体之间的强相互作用以及梯形结构的BN骨架,该值是已报道最大值的两倍多。优异的热导率已通过理论计算和CPU的散热得到验证。本研究为定制复合界面提供了一种创新设计原则,并为开发高性能复合材料开辟了一条新途径。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1885/9705632/47b8a62a2b7a/40820_2022_972_Fig1_HTML.jpg

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