Wang Chengli, Li Jin, Yi Ailun, Fang Zhiwei, Zhou Liping, Wang Zhe, Niu Rui, Chen Yang, Zhang Jiaxiang, Cheng Ya, Liu Junqiu, Dong Chun-Hua, Ou Xin
State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 200050, Shanghai, China.
The Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, 100049, Beijing, China.
Light Sci Appl. 2022 Dec 7;11(1):341. doi: 10.1038/s41377-022-01042-w.
Recent advancements in integrated soliton microcombs open the route to a wide range of chip-based communication, sensing, and metrology applications. The technology translation from laboratory demonstrations to real-world applications requires the fabrication process of photonics chips to be fully CMOS-compatible, such that the manufacturing can take advantage of the ongoing evolution of semiconductor technology at reduced cost and with high volume. Silicon nitride has become the leading CMOS platform for integrated soliton devices, however, it is an insulator and lacks intrinsic second-order nonlinearity for electro-optic modulation. Other materials have emerged such as AlN, LiNbO, AlGaAs and GaP that exhibit simultaneous second- and third-order nonlinearities. Here, we show that silicon carbide (SiC) -- already commercially deployed in nearly ubiquitous electrical power devices such as RF electronics, MOSFET, and MEMS due to its wide bandgap properties, excellent mechanical properties, piezoelectricity and chemical inertia -- is a new competitive CMOS-compatible platform for nonlinear photonics. High-quality-factor microresonators (Q = 4 × 10) are fabricated on 4H-SiC-on-insulator thin films, where a single soliton microcomb is generated. In addition, we observe wide spectral translation of chaotic microcombs from near-infrared to visible due to the second-order nonlinearity of SiC. Our work highlights the prospects of SiC for future low-loss integrated nonlinear and quantum photonics that could harness electro-opto-mechanical interactions on a monolithic platform.
集成孤子微梳的最新进展为广泛的基于芯片的通信、传感和计量应用开辟了道路。从实验室演示到实际应用的技术转化要求光子芯片的制造工艺完全与CMOS兼容,以便制造过程能够利用半导体技术的不断发展,以降低成本并实现大批量生产。氮化硅已成为集成孤子器件的领先CMOS平台,然而,它是一种绝缘体,缺乏用于电光调制的固有二阶非线性。其他材料如AlN、LiNbO、AlGaAs和GaP已经出现,它们表现出同时具有二阶和三阶非线性。在这里,我们表明碳化硅(SiC)——由于其宽带隙特性、优异的机械性能、压电性和化学惰性,已在几乎无处不在的电力设备(如射频电子器件、MOSFET和MEMS)中商业部署——是一种用于非线性光子学具有竞争力的新型CMOS兼容平台。在绝缘体上4H-SiC薄膜上制造了高品质因数微谐振器(Q = 4×10),并在其中产生了单个孤子微梳。此外,由于SiC的二阶非线性,我们观察到混沌微梳从近红外到可见光的宽光谱转换。我们的工作突出了SiC在未来低损耗集成非线性和量子光子学方面的前景,这些光子学可以在单片平台上利用电光机械相互作用。