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环氧树脂增强的Sn-3.0Ag-0.5Cu复合焊膏的微观结构与剪切行为

Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin.

作者信息

Zhang Peng, Xue Songbai, Liu Lu, Wu Jie, Luo Qingcheng, Wang Jianhao

机构信息

College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China.

Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka 565-0047, Japan.

出版信息

Polymers (Basel). 2022 Dec 4;14(23):5303. doi: 10.3390/polym14235303.

DOI:10.3390/polym14235303
PMID:36501697
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC9735467/
Abstract

With the rapid development of microelectronics packaging technology, the demand for high-performance packaging materials has further increased. This paper developed novel epoxy-containing Sn-3.0Ag-0.5Cu (SAC305-ER) composite solder pastes, and the effects of epoxy resin on their spreading performance, microstructure, and shear behaviour were analysed. The research results showed that with the addition of epoxy resin, SAC305 solder pastes exhibited exceptional spreadability on Cu substrates, which could be attributed to the reduction in the viscosity and the surface tension of the composite solder pastes. With the addition of epoxy resin, the solder matrix microstructure and interfacial morphology of SAC305-ER composite solder joints remained unchanged. However, continuous resin protective layers were observed on the surface of SAC305-ER composite solder joints after the reflow process. The shear properties of the composite solder joints were enhanced by the extra mechanical bonding effect provided by resin layers. When the epoxy resin content was 8 wt%, the shear forces of SAC305-ER composite solder joints reached the maximum value. Fracture analysis indicated that cracked epoxy resin was observed on the surface of SAC305-ER composite solder joints, indicating that the epoxy resin also underwent obvious deformation in the shear test.

摘要

随着微电子封装技术的快速发展，对高性能封装材料的需求进一步增加。本文研制了新型含环氧树脂的Sn-3.0Ag-0.5Cu（SAC305-ER）复合焊膏，并分析了环氧树脂对其铺展性能、微观结构和剪切行为的影响。研究结果表明，添加环氧树脂后，SAC305焊膏在铜基板上表现出优异的铺展性，这可归因于复合焊膏粘度和表面张力的降低。添加环氧树脂后，SAC305-ER复合焊点的焊料基体微观结构和界面形态保持不变。然而，回流工艺后在SAC305-ER复合焊点表面观察到连续的树脂保护层。树脂层提供的额外机械结合效应增强了复合焊点的剪切性能。当环氧树脂含量为8 wt%时，SAC305-ER复合焊点的剪切力达到最大值。断口分析表明，在SAC305-ER复合焊点表面观察到环氧树脂开裂，表明环氧树脂在剪切试验中也发生了明显变形。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/5ef22ac239c6/polymers-14-05303-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/02e4d191bb28/polymers-14-05303-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/23067e4710bd/polymers-14-05303-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/62fb62c5bf10/polymers-14-05303-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/7d17e0d97011/polymers-14-05303-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/cbae1ab708e7/polymers-14-05303-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/3c06f5447b9e/polymers-14-05303-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/54375fc6b21d/polymers-14-05303-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/dd694be3a16d/polymers-14-05303-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/3a3acc5d6004/polymers-14-05303-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/5ef22ac239c6/polymers-14-05303-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/02e4d191bb28/polymers-14-05303-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/23067e4710bd/polymers-14-05303-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/62fb62c5bf10/polymers-14-05303-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/7d17e0d97011/polymers-14-05303-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/cbae1ab708e7/polymers-14-05303-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/3c06f5447b9e/polymers-14-05303-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/54375fc6b21d/polymers-14-05303-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/dd694be3a16d/polymers-14-05303-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/3a3acc5d6004/polymers-14-05303-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/fa4c/9735467/5ef22ac239c6/polymers-14-05303-g010.jpg

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