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环氧增强型SAC305焊点的热循环可靠性研究

Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint.

作者信息

Zhang Peng, Xue Songbai, Liu Lu, Wang Jianhao, Tatsumi Hiroaki, Nishikawa Hiroshi

机构信息

College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China.

Joining and Welding Research Institute, Osaka University, Ibaraki 5670047, Japan.

出版信息

Polymers (Basel). 2024 Sep 14;16(18):2597. doi: 10.3390/polym16182597.

DOI:10.3390/polym16182597
PMID:39339061
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11435804/
Abstract

In this work, epoxy was added into commercial Sn-3.0Ag-0.5Cu (SAC305) solder paste to enhance the thermal cycling reliability of the joint. The microstructure and fracture surface were observed using a scanning electron microscope/energy dispersive spectrometer (SEM/EDS), and a shear test was performed on the thermally cycled joint samples. The results indicated that during the thermal cycling test, the epoxy protective layer on the surface of the epoxy-enhanced SAC305 solder joint could significantly alleviate the thermal stress caused by coefficients of thermal expansion (CTE) mismatch, resulting in fewer structural defects. The interfacial compound of the original SAC305 solder joints gradually coarsened due to the accelerated atomic diffusion, but epoxy-enhanced SAC305 solder joints demonstrated a thinner interfacial layer and a smaller IMC grain size. Due to the reduced stress concentration and the additional mechanical support provided by the cured epoxy layer, epoxy-enhanced SAC305 solder joints displayed superior shear performance compared to the original joint during the thermal cycling test. After 1000 thermal cycles, Cu-Sn IMC regions were observed on the fracture surfaces of the original SAC305 solder joint, exhibiting brittle fracture characteristics. However, the fracture of the SAC305 solder joint with 8 wt.% epoxy remained within the solder bulk and exhibited a ductile fracture mode. This work indicates that epoxy-enhanced SAC305 solder pastes display high thermal cycling reliability and could meet the design needs of advanced packaging technology for high-performance electronic packaging materials.

摘要

在这项工作中，将环氧树脂添加到商用Sn-3.0Ag-0.5Cu（SAC305）焊膏中，以提高接头的热循环可靠性。使用扫描电子显微镜/能谱仪（SEM/EDS）观察微观结构和断口表面，并对热循环后的接头样品进行剪切试验。结果表明，在热循环试验期间，环氧树脂增强的SAC305焊点表面的环氧树脂保护层可显著减轻由热膨胀系数（CTE）不匹配引起的热应力，从而减少结构缺陷。原始SAC305焊点的界面化合物由于原子扩散加速而逐渐粗化，但环氧树脂增强的SAC305焊点显示出较薄的界面层和较小的金属间化合物晶粒尺寸。由于应力集中降低以及固化环氧树脂层提供的额外机械支撑，环氧树脂增强的SAC305焊点在热循环试验期间表现出比原始接头更好的剪切性能。经过1000次热循环后，在原始SAC305焊点的断口表面观察到Cu-Sn金属间化合物区域，呈现脆性断裂特征。然而，含有8 wt.%环氧树脂的SAC305焊点的断裂仍在焊料本体内部，并呈现韧性断裂模式。这项工作表明，环氧树脂增强的SAC305焊膏具有高的热循环可靠性，能够满足高性能电子封装材料先进封装技术的设计需求。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e17/11435804/ce84358ff04c/polymers-16-02597-g016.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e17/11435804/ce84358ff04c/polymers-16-02597-g016.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e17/11435804/6a9a66b12fd6/polymers-16-02597-g014.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e17/11435804/d676d74ecf55/polymers-16-02597-g017.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e17/11435804/fa3aecdcc744/polymers-16-02597-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e17/11435804/62f55d59efd3/polymers-16-02597-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e17/11435804/c32c9eb3b2cd/polymers-16-02597-g003.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e17/11435804/12df0f6123a4/polymers-16-02597-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e17/11435804/0ee7d59b2d7e/polymers-16-02597-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e17/11435804/b12f82d92506/polymers-16-02597-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e17/11435804/75039547d3b6/polymers-16-02597-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e17/11435804/1023cf6aa9ba/polymers-16-02597-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e17/11435804/d61bbca94b44/polymers-16-02597-g015.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6e17/11435804/ce84358ff04c/polymers-16-02597-g016.jpg

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本文引用的文献

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2
Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin.环氧树脂增强的Sn-3.0Ag-0.5Cu复合焊膏的微观结构与剪切行为
Polymers (Basel). 2022 Dec 4;14(23):5303. doi: 10.3390/polym14235303.
3
Effect of MWNT Functionalization with Tunable-Length Block Copolymers on Dispersity of MWNTs and Mechanical Properties of Epoxy/MWNT Composites.
可调长度嵌段共聚物对多壁碳纳米管的功能化作用对多壁碳纳米管分散性及环氧/多壁碳纳米管复合材料力学性能的影响。
Polymers (Basel). 2022 Aug 1;14(15):3137. doi: 10.3390/polym14153137.
4
Reliability issues of lead-free solder joints in electronic devices.电子设备中无铅焊点的可靠性问题。
Sci Technol Adv Mater. 2019 Jul 11;20(1):876-901. doi: 10.1080/14686996.2019.1640072. eCollection 2019.