Li Zheng, Yu Jian, Khuje Saurabh, Sheng Aaron, Navarro Marieross, Zhuang Cheng-Gang, Ren Shenqiang
Department of Mechanical and Aerospace Engineering, University at Buffalo, The State University of New York Buffalo New York 14260 USA
DEVCOM Army Research Laboratory Aberdeen Proving Ground MD 21005 USA.
Nanoscale Adv. 2022 Oct 25;4(23):5132-5136. doi: 10.1039/d2na00452f. eCollection 2022 Nov 22.
Advanced materials capable of withstanding extreme environments garner extensive interest in the development of next-generation advanced anti-corrosion electronics. Herein, we report that the surface passivation of printed copper conductors imparts corrosion resistance in high-temperature sulfurous environments while maintaining a high electrical conductivity of 4.42 MS m when subjected to a sulfur-containing environment at 350 °C for 12 h. This study provides potential for the development of surface-passivated copper conductors that are resistant to the sulfidizing environments found in several applications of modern technology.
能够承受极端环境的先进材料在下一代先进防腐电子器件的开发中引起了广泛关注。在此,我们报告,印刷铜导体的表面钝化在高温含硫环境中赋予了耐腐蚀性,同时在350°C的含硫环境中暴露12小时后仍保持4.42 MS m的高电导率。这项研究为开发能够抵抗现代技术多种应用中发现的硫化环境的表面钝化铜导体提供了可能性。