Gong Cheng, Zhang Cong, Zhuang Qixin, Li Haiyun, Yang Hua, Chen Jiangzhao, Zang Zhigang
Key Laboratory of Optoelectronic Technology and Systems (Ministry of Education), Chongqing University, Chongqing, 400044, People's Republic of China.
Institute of High Energy Physics, Chinese Academy of Sciences (CAS), Beijing, 100049, People's Republic of China.
Nanomicro Lett. 2022 Dec 29;15(1):17. doi: 10.1007/s40820-022-00992-5.
The interfacial defects and energy barrier are main reasons for interfacial nonradiative recombination. In addition, poor perovskite crystallization and incomplete conversion of PbI to perovskite restrict further enhancement of the photovoltaic performance of the devices using sequential deposition. Herein, a buried interface stabilization strategy that relies on the synergy of fluorine (F) and sulfonyl (S=O) functional groups is proposed. A series of potassium salts containing halide and non-halogen anions are employed to modify SnO/perovskite buried interface. Multiple chemical bonds including hydrogen bond, coordination bond and ionic bond are realized, which strengthens interfacial contact and defect passivation effect. The chemical interaction between modification molecules and perovskite along with SnO heightens incessantly as the number of S=O and F augments. The chemical interaction strength between modifiers and perovskite as well as SnO gradually increases with the increase in the number of S=O and F. The defect passivation effect is positively correlated with the chemical interaction strength. The crystallization kinetics is regulated through the compromise between chemical interaction strength and wettability of substrates. Compared with Cl, all non-halogen anions perform better in crystallization optimization, energy band regulation and defect passivation. The device with potassium bis (fluorosulfonyl) imide achieves a tempting efficiency of 24.17%.
界面缺陷和能垒是界面非辐射复合的主要原因。此外,钙钛矿结晶性差以及PbI向钙钛矿的不完全转化限制了采用顺序沉积法制备的器件光伏性能的进一步提高。在此,提出了一种基于氟(F)和磺酰基(S=O)官能团协同作用的掩埋界面稳定策略。采用一系列含卤化物和非卤素阴离子的钾盐对SnO/钙钛矿掩埋界面进行修饰。实现了包括氢键、配位键和离子键在内的多种化学键,增强了界面接触和缺陷钝化效果。随着S=O和F数量的增加,修饰分子与钙钛矿以及SnO之间的化学相互作用不断增强。随着S=O和F数量的增加,修饰剂与钙钛矿以及SnO之间的化学相互作用强度逐渐增大。缺陷钝化效果与化学相互作用强度呈正相关。通过化学相互作用强度与基底润湿性之间的折衷来调节结晶动力学。与Cl相比,所有非卤素阴离子在结晶优化、能带调控和缺陷钝化方面表现更好。采用双(氟磺酰)亚胺钾的器件实现了诱人的24.17%的效率。