Wu Tianyu, Huan Xianhua, Zhang Hongmingjian, Wu Lingyun, Sui Gang, Yang Xiaoping
State Key Laboratory of Organic-Inorganic Composites, College of Materials Science and Engineering, Beijing University of Chemical Technology, North Third Ring Road 15, Chaoyang District, Beijing 100029, PR China.
School of Electrical and Automation Engineering, Hefei University of Technology, Hefei 230009, PR China.
J Colloid Interface Sci. 2023 May 15;638:392-402. doi: 10.1016/j.jcis.2023.02.014. Epub 2023 Feb 3.
Carbon nanofiber (CNF)/polycaprolactone (PCL) composites were three-dimention (3D) printed into electromagnetic interference (EMI) shielding parts. 3D-printing process led to an inhomogeneous CNFs distribution in printed composites. The special high-resistance "internal surfaces" introduced between printed threads reduced the conductivity of printed parts and resulted in characteristic secondary percolation phenomena. Meanwhile, the accelerated melt flow in nozzle oriented CNFs in composites along the printing direction, increasing the percolation threshold compared to the random arrangement. As two stage of percolation networks formed, the 3D-printed CNF/PCL parts exhibited excellent EMI shielding performance, with EMI shielding effectiveness value up to 58.7 dB. By controlling the packing density of the printed part, a large number of apertures and heterogeneous interfaces were easily introduced into the interior of parts. It promoted multiple reflection and absorption of electromagnetic waves inside the parts, and enabled adjustment of weight and shielding effectiveness. Therefore, the 3D printing enabled the flexible formation of complex porous structures. From basic materials to designed components, the 3D printing technology can facilitate the transformation of shielding materials into high performance components that are finely designed both internally and externally, making it a promising technology in the field of manufacturing lightweight, high performance EMI shielding materials.
将碳纳米纤维(CNF)/聚己内酯(PCL)复合材料三维(3D)打印成电磁干扰(EMI)屏蔽部件。3D打印过程导致打印复合材料中CNF分布不均匀。打印线条之间引入的特殊高电阻“内表面”降低了打印部件的导电性,并导致了特征性的二次渗流现象。同时,喷嘴中加速的熔体流动使复合材料中的CNF沿打印方向排列,与随机排列相比增加了渗流阈值。随着两级渗流网络的形成,3D打印的CNF/PCL部件表现出优异的EMI屏蔽性能,EMI屏蔽效能值高达58.7 dB。通过控制打印部件的堆积密度,大量的孔隙和异质界面很容易被引入到部件内部。这促进了部件内部电磁波的多次反射和吸收,并实现了重量和屏蔽效能的调节。因此,3D打印能够灵活地形成复杂的多孔结构。从基础材料到设计部件,3D打印技术可以促进屏蔽材料向内部和外部都经过精细设计的高性能部件的转变,使其成为制造轻质、高性能EMI屏蔽材料领域中一项很有前景的技术。