KIURI Center for Hydrogen Based Next Generation Mechanical System, Inha University, Incheon 21999, Republic of Korea.
Department of Stretchable Task Team, LG Display, Seoul 07796, Republic of Korea.
Sensors (Basel). 2023 Jan 26;23(3):1381. doi: 10.3390/s23031381.
Currently, silicon-strain-gauge-based diaphragm pressure sensors use four single-gauge chips for high-output sensitivity. However, the four-single-gauge configuration increases the number of glass frit bonds and the number of aluminum wire bonds, reducing the long-term stability, reliability, and yield of the diaphragm pressure sensor. In this study, a new design of general-purpose silicon strain gauges was developed to improve the sensor output voltage while reducing the number of bonds. The new gauges consist grid patterns with a reciprocating arc of silicon piezoresistors on a thin glass backing. The gauges make handling easier in the bonding process due to the use of thin glass for the gauge backing. The pressure sensors were tested under pressure ranging from 0 to 50 bar at five different temperatures, with a linear output with a typical sensitivity of approximately 16 mV/V/bar and an offset shift of -6 mV to 2 mV. The new approach also opens the possibility to extend arc strain gauges to half-bridge and full-bridge configurations to further reduce the number of glass frit and Al wire bonds in the diaphragm pressure sensor.
目前，基于硅应变计的膜片压力传感器采用四个单应变计芯片来实现高输出灵敏度。然而，四单应变计的配置增加了玻璃料 frit 键合和铝丝键合的数量，降低了膜片压力传感器的长期稳定性、可靠性和成品率。在本研究中，开发了一种新的通用硅应变计设计，以提高传感器输出电压，同时减少键合数量。新的应变计由在薄玻璃衬底上的硅压阻器的往复弧形组成的栅格图案。由于应变计背衬使用了薄玻璃，因此在键合过程中更容易处理。压力传感器在五个不同温度下进行了从 0 到 50 巴的压力测试，输出呈线性，典型灵敏度约为 16 mV/V/bar，偏移量为-6 mV 到 2 mV。这种新方法还为将弧形应变计扩展到半桥和全桥配置开辟了可能性，以进一步减少膜片压力传感器中的玻璃料 frit 和铝丝键合数量。
