Le Wenkai, Yang Wenwei, Sheng Wenwen, Shuai Jing
School of Materials, Sun Yat-sen University, Shenzhen 518107, People's Republic of China.
ACS Appl Mater Interfaces. 2023 Mar 15;15(10):12611-12621. doi: 10.1021/acsami.2c21035. Epub 2023 Mar 1.
Intensive efforts have been conducted to realize the reliable interfacial joining of thermoelectric materials and electrode materials with low interfacial contact resistance, which is an essential step to make thermoelectric materials into thermoelectric devices for industrial application. In this review, the roles of structural integrity, interdiffusion, and contact resistance in long-term reliabilities of thermoelectric modules are outlined first. Then interfacial reactions of near-room-temperature BiTe-based thermoelectric materials and various electrode materials are reviewed comprehensively. We also summarized the joining behavior of the mid-temperature PbTe-based thermoelectric materials and commonly used electrode materials. Subsequently, for other thermoelectric materials systems, i.e., SiGe, CoSb, and MgSb, previous attempts to join with some electrode materials are also recapitulated. Finally, some future prospects to further improve the joint reliability in thermoelectric device manufacturing are proposed. We believe that this review will provide guidance for preparing thermoelectric devices and optimizing thermoelectric device design.
人们已经做出了巨大努力来实现热电材料与电极材料的可靠界面连接，且界面接触电阻低，这是将热电材料制成用于工业应用的热电器件的关键一步。在这篇综述中，首先概述了结构完整性、相互扩散和接触电阻在热电模块长期可靠性中的作用。然后全面综述了近室温BiTe基热电材料与各种电极材料的界面反应。我们还总结了中温PbTe基热电材料与常用电极材料的连接行为。随后，对于其他热电材料体系，即SiGe、CoSb和MgSb，也概述了之前与某些电极材料连接的尝试。最后，提出了在热电器件制造中进一步提高连接可靠性的一些未来展望。我们相信，这篇综述将为制备热电器件和优化热电器件设计提供指导。
