Abdul Razak Nurul Ellena, Dee Chang Fu, Madhuku Morgan, Ahmad Ishaq, Chang Edward Yi, Yu Hung Wei, Majlis Burhanuddin Yeop, Berhanuddin Dilla Duryha
Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (UKM), Bangi 43600, Malaysia.
iThemba Laboratory for Accelerator Based Science (LABS), Johannesburg 2050, South Africa.
Materials (Basel). 2023 Mar 2;16(5):2070. doi: 10.3390/ma16052070.
The super enhancement of silicon band edge luminescence when co-implanted with boron and carbon is reported. The role of boron in the band edge emissions in silicon was investigated by deliberately introducing defects into the lattice structures. We aimed to increase the light emission intensity from silicon by boron implantation, leading to the formation of dislocation loops between the lattice structures. The silicon samples were doped with a high concentration of carbon before boron implantation and then annealed at a high temperature to activate the dopants into substitutional lattice sites. Photoluminescence (PL) measurements were performed to observe the emissions at the near-infrared region. The temperatures were varied from 10 K to 100 K to study the effect of temperature on the peak luminescence intensity. Two main peaks could be seen at ~1112 and 1170 nm by observing the PL spectra. The intensities shown by both peaks in the samples incorporated with boron are significantly higher than those in pristine silicon samples, and the highest intensity in the former was 600 times greater than that in the latter. Transmission electron microscopy (TEM) was used to study the structure of post-implant and post-anneal silicon sample. The dislocation loops were observed in the sample. Through a technique compatible with mature silicon processing technology, the results of this study will greatly contribute to the development of all Si-based photonic systems and quantum technologies.
据报道,当硅与硼和碳共注入时,硅带边发光会出现超增强现象。通过故意在晶格结构中引入缺陷,研究了硼在硅带边发射中的作用。我们旨在通过硼注入提高硅的发光强度,从而在晶格结构之间形成位错环。在硼注入之前,硅样品先被高浓度碳掺杂,然后在高温下退火,以使掺杂剂激活进入替代晶格位置。进行光致发光(PL)测量以观察近红外区域的发射。温度在10 K至100 K之间变化,以研究温度对峰值发光强度的影响。通过观察PL光谱,在~1112和1170 nm处可以看到两个主要峰。掺入硼的样品中两个峰的强度明显高于原始硅样品中的强度,前者的最高强度比后者大600倍。使用透射电子显微镜(TEM)研究注入后和退火后的硅样品结构。在样品中观察到位错环。通过一种与成熟硅加工技术兼容的技术,本研究结果将极大地促进全硅基光子系统和量子技术的发展。