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碲锡光电二极管短波红外探测与成像。

Te Se Photodiode Shortwave Infrared Detection and Imaging.

机构信息

Wuhan National Laboratory for Optoelectronics (WNLO), School of Optical and Electronic Information (SOEI), Huazhong University of Science and Technology, Wuhan, Hubei, 430074, P. R. China.

China-EU Institute for Clean and Renewable Energy, Huazhong University of Science and Technology, Wuhan, Hubei, 430074, P. R. China.

出版信息

Adv Mater. 2023 Jun;35(24):e2211522. doi: 10.1002/adma.202211522. Epub 2023 Apr 28.

DOI:10.1002/adma.202211522
PMID:36972712
Abstract

Short-wave infrared detectors are increasingly important in the fields of autonomous driving, food safety, disease diagnosis, and scientific research. However, mature short-wave infrared cameras such as InGaAs have the disadvantage of complex heterogeneous integration with complementary metal-oxide-semiconductor (CMOS) readout circuits, leading to high cost and low imaging resolution. Herein, a low-cost, high-performance, and high-stability Te Se short-wave infrared photodiode detector is reported. The Te Se thin film is fabricated through CMOS-compatible low-temperature evaporation and post-annealing process, showcasing the potential of direct integration on the readout circuit. The device demonstrates a broad-spectrum response of 300-1600 nm, a room-temperature specific detectivity of 1.0 × 10 Jones, a -3 dB bandwidth up to 116 kHz, and a linear dynamic range of over 55 dB, achieving the fastest response among Te-based photodiode devices and a dark current density 7 orders of magnitude smaller than Te-based photoconductive and field-effect transistor devices. With a simple Si N packaging, the detector shows high electric stability and thermal stability, meeting the requirements for vehicular applications. Based on the optimized Te Se photodiode detector, the applications in material identification and masking imaging is demonstrated. This work paves a new way for CMOS-compatible infrared imaging chips.

摘要

短波红外探测器在自动驾驶、食品安全、疾病诊断和科学研究等领域变得越来越重要。然而,成熟的短波红外相机,如 InGaAs,具有与互补金属氧化物半导体 (CMOS) 读出电路进行复杂异质集成的缺点,导致成本高和成像分辨率低。本文报道了一种低成本、高性能和高稳定性的 TeSe 短波红外光电二极管探测器。通过 CMOS 兼容的低温蒸发和后退火工艺制备了 TeSe 薄膜,展示了在读出电路上直接集成的潜力。该器件在 300-1600nm 范围内具有宽光谱响应,室温下的特定探测率为 1.0×10^9 Jones,-3dB 带宽高达 116kHz,线性动态范围超过 55dB,实现了基于 Te 的光电二极管器件中最快的响应,暗电流密度比基于 Te 的光电导和场效应晶体管器件小 7 个数量级。通过简单的 SiN 封装,探测器表现出高的电稳定性和热稳定性,满足车载应用的要求。基于优化的 TeSe 光电二极管探测器,展示了在材料识别和掩模成像方面的应用。这项工作为 CMOS 兼容的红外成像芯片开辟了新途径。

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