Puchnin Kirill, Ryazantsev Dmitriy, Latipov Egor, Grudtsov Vitaliy, Kuznetsov Alexander
Scientific-Manufacturing Complex Technological Centre, Zelenograd 124498, Russia.
Institute of Nanotechnology of Microelectronics of the Russian Academy of Sciences, Moscow 119991, Russia.
Polymers (Basel). 2023 Mar 7;15(6):1329. doi: 10.3390/polym15061329.
The use of polymers in silicon chips is of great importance for the development of microelectronic and biomedical industries. In this study, new silane-containing polymers, called OSTE-AS polymers, were developed based on off-stoichiometry thiol-ene polymers. These polymers can bond to silicon wafers without pretreatment of the surface by an adhesive. Silane groups were included in the polymer using allylsilanes, with the thiol monomer as the target of modification. The polymer composition was optimized to provide the maximum hardness, the maximum tensile strength, and good bonding with the silicon wafers. The Young's modulus, wettability, dielectric constant, optical transparency, TGA and DSC curves, and the chemical resistance of the optimized OSTE-AS polymer were studied. Thin OSTE-AS polymer layers were obtained on silicon wafers via centrifugation. The possibility of creating microfluidic systems based on OSTE-AS polymers and silicon wafers was demonstrated.
聚合物在硅芯片中的应用对微电子和生物医学产业的发展至关重要。在本研究中，基于非化学计量硫醇-烯聚合物开发了一种新型含硅烷聚合物，称为OSTE-AS聚合物。这些聚合物无需通过粘合剂对硅片表面进行预处理即可与之结合。使用烯丙基硅烷将硅烷基团引入聚合物中，以硫醇单体作为改性目标。对聚合物组成进行了优化，以提供最大硬度、最大拉伸强度以及与硅片的良好结合。研究了优化后的OSTE-AS聚合物的杨氏模量、润湿性、介电常数、光学透明度、热重分析（TGA）和差示扫描量热法（DSC）曲线以及耐化学性。通过离心在硅片上获得了薄的OSTE-AS聚合物层。证明了基于OSTE-AS聚合物和硅片创建微流体系统的可能性。
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