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用于先进封装技术的含硅烷基团的非化学计量硫醇-烯聚合物。

Off-Stoichiometry Thiol-Enes Polymers Containing Silane Groups for Advanced Packaging Technologies.

作者信息

Puchnin Kirill, Ryazantsev Dmitriy, Grudtsov Vitaliy, Golubev Yaroslav, Kuznetsov Alexander

机构信息

Scientific-Manufacturing Complex "Technological Centre", Zelenograd 124498, Russia.

Institute of Nanotechnology of Microelectronics of the Russian Academy of Sciences, Moscow 119991, Russia.

出版信息

Polymers (Basel). 2022 May 13;14(10):1988. doi: 10.3390/polym14101988.

Abstract

New modified off-stoichiometry thiol-enes polymers, called OSTE-MS polymers, were developed by introducing mercaptosilane into the polymer mixture. This modification made it possible to introduce silane groups into the polymer frame, due to which the polymer gained the ability to bond with silicon wafers without modification of the wafer surface by any adhesive. The optimal composition for creating 3D polymer structures on a chip was selected, which consists of a volume ratio of 6:6:1 of allyl monomer, mercapto monomer, and mercaptosilane, respectively. The hardness, shift force, tensile strength, Young's modulus, optical transparency, glass transition temperature, thermal stability, and chemical resistance of the OSTE-MS polymer, and the viscosity for the prepolymer mixture were studied. On the basis of the OSTE-MS polymer, 3D polymer structures of the well type and microfluidic system on the silicon chips were obtained.

摘要

通过将巯基硅烷引入聚合物混合物中,开发出了一种新型改性非化学计量比硫醇-烯聚合物,称为OSTE-MS聚合物。这种改性使得将硅烷基团引入聚合物骨架成为可能,由此聚合物获得了无需使用任何粘合剂对硅片表面进行改性就能与硅片结合的能力。选择了用于在芯片上创建三维聚合物结构的最佳组成,其分别由烯丙基单体、巯基单体和巯基硅烷的体积比为6:6:1组成。研究了OSTE-MS聚合物的硬度、位移力、拉伸强度、杨氏模量、光学透明度、玻璃化转变温度、热稳定性和耐化学性,以及预聚物混合物的粘度。基于OSTE-MS聚合物,在硅芯片上获得了阱型和微流体系统的三维聚合物结构。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d4cd/9147012/d8b01880a9e5/polymers-14-01988-g001.jpg

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