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利用具有可调谐辐射器的 Si 光学相控阵实现高精度 3D 成像。

Demonstration of high-accuracy 3D imaging using a Si optical phased array with a tunable radiator.

出版信息

Opt Express. 2023 Mar 13;31(6):9935-9944. doi: 10.1364/OE.481229.

Abstract

Precise imaging in three-dimension (3D) is an essential technique for solid-state light detection and ranging (LiDAR). Among various solid-state LiDAR technologies, silicon (Si) optical phased array (OPA)-based LiDAR has the significant advantage of robust 3D imaging due to its high scanning speed, low power consumption, and compactness. Numerous techniques employing a Si OPA have utilized two-dimensional arrays or wavelength tuning for longitudinal scanning but the operation of those systems is restricted by additional requirements. Here, we demonstrate high-accuracy 3D imaging using a Si OPA with a tunable radiator. As we adapted a time-of-flight approach for distance measurement, we have developed an optical pulse modulator that allows a ranging accuracy of less than 2 cm. The implemented Si OPA is composed of an input grating coupler, multimode interferometers, electro-optic p-i-n phase shifters, and thermo-optic n-i-n tunable radiators. With this system, it is possible to attain a wide beam steering range of 45° in a transversal angle with a 0.7° divergence angle, and 10° in a longitudinal angle with a 0.6° divergence angle can be achieved using Si OPA. The character toy model was successfully imaged in three dimensions with a range resolution of 2 cm using the Si OPA. The further improvement of each component of the Si OPA will allow even more accurate 3D imaging over a longer distance.

摘要

在三维(3D)中进行精确成像,是固态光探测和测距(LiDAR)的一项关键技术。在各种固态 LiDAR 技术中,硅(Si)光学相控阵(OPA)基 LiDAR 具有高扫描速度、低功耗和紧凑性等显著优势,可实现稳健的 3D 成像。许多采用 Si OPA 的技术利用二维阵列或波长调谐来进行纵向扫描,但这些系统的操作受到额外要求的限制。在这里,我们展示了一种使用可调谐辐射器的 Si OPA 进行高精度 3D 成像。由于我们采用了飞行时间方法进行距离测量,因此开发了一种光学脉冲调制器,其测距精度可低于 2cm。所实现的 Si OPA 由输入光栅耦合器、多模干涉仪、电光 p-i-n 相移器和热光 n-i-n 可调谐辐射器组成。通过该系统,可以实现 45°的宽光束转向范围,横向角的发散角为 0.7°,纵向角的发散角为 0.6°,可使用 Si OPA 实现。使用 Si OPA,成功地对三维字符玩具模型进行了成像,其距离分辨率为 2cm。Si OPA 的每个组件的进一步改进将允许在更远的距离上进行更精确的 3D 成像。

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