E Yiyang, Tian Zhaobo, Chi Keyu, Jiang Renyao, Lv You, Sun Qi, Zhu Yuan
School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China.
Baopeng New Materials Technology Co., Ltd., Shenzhen 518055, China.
Polymers (Basel). 2023 May 17;15(10):2338. doi: 10.3390/polym15102338.
With the miniaturization of electronic devices, electronic packaging has become increasingly precise and complex, which presents a significant challenge in terms of heat dissipation. Electrically conductive adhesives (ECAs), particularly silver epoxy adhesives, have emerged as a new type of electronic packaging material, thanks to their high conductivity and stable contact resistance. However, while there has been extensive research on silver epoxy adhesives, little attention has been paid to improving their thermal conductivity, which is a critical requirement in the ECA industry. In this paper, we propose a straightforward method for treating silver epoxy adhesive with water vapor, resulting in a remarkable improvement in thermal conductivity to 9.1 W/(m·K), three times higher than the sample cured using traditional methods (2.7 W/(m·K)). Through research and analysis, the study demonstrates that the introduction of HO into the gaps and holes of the silver epoxy adhesive increases the path of electron conduction, thereby improving thermal conductivity. Furthermore, this method has the potential to significantly improve the performance of packaging materials and meet the needs of high-performance ECAs.
随着电子设备的小型化，电子封装变得越来越精确和复杂，这在散热方面带来了重大挑战。导电胶粘剂（ECAs），特别是银环氧胶粘剂，由于其高导电性和稳定的接触电阻，已成为一种新型的电子封装材料。然而，尽管对银环氧胶粘剂进行了广泛的研究，但对提高其热导率的关注却很少，而热导率是ECA行业的一项关键要求。在本文中，我们提出了一种用水蒸气处理银环氧胶粘剂的简单方法，使热导率显著提高到9.1W/（m·K），比使用传统方法固化的样品（2.7W/（m·K））高出三倍。通过研究和分析，该研究表明，将HO引入银环氧胶粘剂的间隙和孔洞中增加了电子传导路径，从而提高了热导率。此外，该方法有可能显著提高包装材料的性能，并满足高性能ECA的需求。
