Liu Guoyue, Wang Jian, Chen Bing, Guo Bing, Zhang Hua, Wang Zhaohui
Hunan Provincial Key Laboratory of High Efficiency and Precision Machining of Difficult-to-Cut Material, School of Mechanical Engineering, Hunan University of Science and Technology, Xiangtan 411201, China.
Hunan Taijia New Material Technology Co., Ltd., Changsha 410203, China.
Materials (Basel). 2023 Jun 30;16(13):4761. doi: 10.3390/ma16134761.
Aiming at problems such as poor precision of laser processing C/SiC composites, low efficiency of grinding C/SiC composites, and serious wear of grinding wheel, a method of laser-grinding chain processing C/SiC composite groove was proposed in this paper. The method combined the high efficiency characteristic of laser ablating and the high precision characteristic of grinding. The relationship between laser processing parameters and the characteristics of ablative grooves was investigated, and the appropriate laser processing parameters were optimized, and then, to further improve the processing quality of the grooves, the grinding parameters optimization experiments of the grooves of C/SiC composites were carried out. The results showed that the C/SiC composites could be quickly removed by laser processing, and the grooves with relatively good size and shape accuracy could be obtained by laser parameters optimization experiments, but the side wall of the groove still had a certain inclination and the surface quality of the groove was yet poor; meanwhile, the size accuracy, shape accuracy, and surface quality of the grooves were greatly improved by further grinding. In addition, then, through the laser and grinding optimization experiments, the optimized parameters were obtained, where the laser power was 80 W, the scanning speed was 300 mm/s, the scanning frequency was 50 kHz, the scanning spacing was 25 μm, the depth of cut was 30 μm, the liner speed of wheel was 62.832 m/min, and the feed speed was 10 mm/min. With these parameters, the time used to process the groove with the laser-grinding chain was about 23/40 of the grinding process, and the quality of grooves could be guaranteed. Therefore, combined with the optimized process parameters, the laser-grinding chain processing scheme could be used to achieve high efficiency and precision grinding of C/SiC composite grooves.
针对激光加工C/SiC复合材料精度差、磨削C/SiC复合材料效率低以及砂轮磨损严重等问题，本文提出了一种激光 - 磨削链式加工C/SiC复合槽的方法。该方法结合了激光烧蚀的高效率特性和磨削的高精度特性。研究了激光加工参数与烧蚀槽特性之间的关系，优化了合适的激光加工参数，然后，为进一步提高槽的加工质量，对C/SiC复合材料槽进行了磨削参数优化实验。结果表明，通过激光加工可快速去除C/SiC复合材料，通过激光参数优化实验可获得尺寸和形状精度相对较好的槽，但槽的侧壁仍有一定倾斜且槽的表面质量较差；同时，通过进一步磨削，槽的尺寸精度、形状精度和表面质量得到了极大提高。此外，通过激光和磨削优化实验，获得了优化参数，其中激光功率为80W，扫描速度为300mm/s，扫描频率为50kHz，扫描间距为25μm，切削深度为30μm，砂轮线速度为62.832m/min，进给速度为10mm/min。采用这些参数，激光 - 磨削链式加工槽所用时间约为磨削工艺的23/40，且能保证槽的质量。因此，结合优化后的工艺参数，激光 - 磨削链式加工方案可实现C/SiC复合槽的高效精密磨削。
