Zhou Mei-Hui, Yin Guang-Zhong, Prolongo Silvia González, Wang De-Yi
Materials Science and Engineering Area, Escuela Superior de Ciencias Experimentales y Tecnología, Universidad Rey Juan Carlos, C/ Tulipán s/n, Móstoles, 28933 Madrid, Spain.
Escuela Politécnica Superior, Universidad Francisco de Vitoria, Ctra. Pozuelo-Majadahonda Km 1, 800, Pozuelo de Alarcón, 28223 Madrid, Spain.
Polymers (Basel). 2023 Jun 26;15(13):2818. doi: 10.3390/polym15132818.
In last years, the requirements for materials and devices have increased exponentially. Greater competitiveness; cost and weight reduction for structural materials; greater power density for electronic devices; higher design versatility; materials customizing and tailoring; lower energy consumption during the manufacturing, transport, and use; among others, are some of the most common market demands. A higher operational efficiency together with long service life claimed. Particularly, high thermally conductive in epoxy resins is an important requirement for numerous applications, including energy and electrical and electronic industry. Over time, these materials have evolved from traditional single-function to multifunctional materials to satisfy the increasing demands of applications. Considering the complex application contexts, this review aims to provide insight into the present state of the art and future challenges of thermally conductive epoxy composites with various functionalities. Firstly, the basic theory of thermally conductive epoxy composites is summarized. Secondly, the review provides a comprehensive description of five types of multifunctional thermally conductive epoxy composites, including their fabrication methods and specific behavior. Furthermore, the key technical problems are proposed, and the major challenges to developing multifunctional thermally conductive epoxy composites are presented. Ultimately, the purpose of this review is to provide guidance and inspiration for the development of multifunctional thermally conductive epoxy composites to meet the increasing demands of the next generation of materials.
近年来,对材料和器件的要求呈指数级增长。更高的竞争力;结构材料的成本和重量降低;电子器件的功率密度提高;更高的设计通用性;材料定制和剪裁;制造、运输和使用过程中的能耗降低等等,都是一些最常见的市场需求。还要求具有更高的运行效率和更长的使用寿命。特别是,环氧树脂具有高导热性是众多应用的重要要求,包括能源以及电气和电子行业。随着时间的推移,这些材料已从传统的单功能材料发展为多功能材料,以满足日益增长的应用需求。考虑到复杂的应用背景,本综述旨在深入了解具有各种功能的导热环氧复合材料的现状和未来挑战。首先,总结了导热环氧复合材料的基本理论。其次,本综述全面描述了五种多功能导热环氧复合材料,包括它们的制备方法和具体性能。此外,提出了关键技术问题,并阐述了开发多功能导热环氧复合材料面临的主要挑战。最终,本综述的目的是为开发多功能导热环氧复合材料提供指导和启发,以满足下一代材料日益增长的需求。