Mameli Alfredo, Teplyakov Andrew V
TNO-Holst Centre, High Tech Campus 31, 5656 AE Eindhoven, The Netherlands.
Department of Chemistry and Biochemistry, University of Delaware, Newark, Delaware 19716, United States.
Acc Chem Res. 2023 Aug 1;56(15):2084-2095. doi: 10.1021/acs.accounts.3c00221. Epub 2023 Jul 18.
ConspectusAtomically precise and highly selective surface reactions are required for advancing microelectronics fabrication. Advanced atomic processing approaches make use of small molecule inhibitors (SMI) to enable selectivity between growth and nongrowth surfaces. The selectivity between growth and nongrowth substrates is eventually lost for any known combinations, because of defects, new defect formation, and simply because of a Boltzmann distribution of molecular reactivities on surfaces. The selectivity can then be restored by introducing etch-back correction steps. Most recent developments combine the design of highly selective combinations of growth and nongrowth substrates with atomically precise cycles of deposition and etching methods. At that point, a single additional step is often used to passivate the unwanted defects or selected surface chemical sites with SMI. This step is designed to chemically passivate the reactive groups and defects of the nongrowth substrates both before and/or during the deposition of material onto the growth substrate. This approach requires applications of the fundamental knowledge of surface chemistry and reactivity of small molecules to effectively block deposition on nongrowth substrates and to not substantially affect deposition on the growth surface. Thus, many of the concepts of classical surface chemistry that had been developed over several decades can be applied to design such small molecule inhibitors. This article will outline the approaches for such design.This is especially important now, since the ever-increasing number of applications of this concept still rely on trial-and-error approaches in selecting SMI. At the same time, there is a very substantial breadth of surface chemical reactivity analysis that can be put to use in this process that will relate the effectiveness of a potential SMI on any combination of surfaces with the following: selectivity; chemical stability of a molecule on a specific surface; volatility; steric hindrance, geometry, packing, and precursor of choice for material deposition; strength of adsorption as detailed by interdisplacement to determine the most stable SMI; fast attachment reaction kinetics; and minimal number of various binding modes.The down-selection of the SMI from the list of chemicals that satisfy the preliminary criteria will be decided based on optimal combinations of these requirements. Although the specifics of SMI selection are always affected by the complexity of the overall process and will depend drastically on the materials and devices that are or will be needed, this roadmap will assist in choosing the potential effective SMIs based on quite an exhaustive set of "SMI families" in connection with general types of target surfaces.
概述
推进微电子制造需要原子精确且高度选择性的表面反应。先进的原子加工方法利用小分子抑制剂(SMI)来实现生长表面和非生长表面之间的选择性。由于缺陷、新缺陷的形成,以及仅仅由于表面分子反应性的玻尔兹曼分布,对于任何已知的组合,生长和非生长衬底之间的选择性最终都会丧失。然后可以通过引入回蚀校正步骤来恢复选择性。最新的进展将生长和非生长衬底的高选择性组合设计与原子精确的沉积和蚀刻方法循环相结合。此时,通常会使用一个额外的步骤,用SMI钝化不需要的缺陷或选定的表面化学位点。该步骤旨在在将材料沉积到生长衬底上之前和/或期间,对非生长衬底的反应性基团和缺陷进行化学钝化。这种方法需要应用表面化学和小分子反应性的基础知识,以有效地阻止在非生长衬底上的沉积,并且基本上不影响在生长表面上的沉积。因此,几十年来发展起来的许多经典表面化学概念可用于设计此类小分子抑制剂。本文将概述这种设计方法。
现在这一点尤其重要,因为这个概念的应用数量不断增加,在选择SMI时仍然依赖试错法。与此同时,有非常广泛的表面化学反应性分析可用于这个过程,这将把潜在SMI在任何表面组合上的有效性与以下因素联系起来:选择性;分子在特定表面上的化学稳定性;挥发性;空间位阻、几何形状、堆积以及材料沉积的首选前驱体;通过相互置换详细描述的吸附强度,以确定最稳定的SMI;快速附着反应动力学;以及最少数量的各种结合模式。
从满足初步标准的化学物质列表中向下选择SMI将基于这些要求的最佳组合来决定。尽管SMI选择的具体细节总是受到整个过程复杂性的影响,并且将极大地取决于现有的或将来需要的材料和器件,但这个路线图将有助于根据与一般类型目标表面相关的相当详尽的“SMI家族”集合来选择潜在有效的SMI。