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本文引用的文献

1
Laser engineered net shaping of antimicrobial and biocompatible titanium-silver alloys.激光工程网成型抗菌和生物相容的钛银合金。
Mater Sci Eng C Mater Biol Appl. 2019 Dec;105:110059. doi: 10.1016/j.msec.2019.110059. Epub 2019 Aug 6.
2
Hierarchical Nanoporous Copper Architectures via 3D Printing Technique for Highly Efficient Catalysts.通过3D打印技术制备用于高效催化剂的分级纳米多孔铜结构
Small. 2019 May;15(22):e1805432. doi: 10.1002/smll.201805432. Epub 2019 Apr 26.
3
Microscale 3D Printing of Nanotwinned Copper.微纳尺度铜的三维打印
Adv Mater. 2018 Jan;30(4). doi: 10.1002/adma.201705107. Epub 2017 Dec 7.
4
Generating liquid nanojets from copper by dual laser irradiation for ultra-high resolution printing.通过双激光辐照从铜中产生液体纳米喷射用于超高分辨率打印。
Opt Express. 2017 Oct 2;25(20):24164-24172. doi: 10.1364/OE.25.024164.

具有增强性能的铜纳米粉末与微米粉末复合材料的简易三维打印

The Facile Three-Dimensional Printing of the Composite of Copper Nanosized Powder and Micron Powder with Enhanced Properties.

作者信息

Zhou Youzhi, He Huijun, Xu Jingjie, Liang Minghui, Wang Limin, Wang Ligen, Pan Xu, Hu Qiang, Zhang Jingguo

机构信息

GRIPM Advanced Materials Co., Ltd., Beijing, China.

GRIPM Research Institute Co., Ltd., GRINM Group, Beijing, China.

出版信息

3D Print Addit Manuf. 2023 Aug 1;10(4):631-639. doi: 10.1089/3dp.2021.0122. Epub 2023 Aug 9.

DOI:10.1089/3dp.2021.0122
PMID:37609581
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC10440659/
Abstract

Three-dimensional (3D) printing of Cu items is a new way to build up the structured Cu materials, but 3D printing of Cu items is usually a challenge because of the high melting point, high thermal conductivity, and high light reflection rate of Cu material. In this study, the composite of Cu microspheres powder and Cu nanoparticles (micro/nano Cu powder) is used to realize the 3D printing of Cu items with the selective laser melting technology. The sintering temperature and the thermal conductivity of micro/nano Cu powder are evidently decreased due to Cu nanoparticles' addition in the micron Cu powder. The results reveal that the 3D printing of 50%/50% micro/nano Cu powder needs laser power range of 100-240 W, which is in contrast to 200-340 W for 3D printing of 100% Cu microspheres powder. Furthermore, the conductivity, mechanical strength, and density of 3D-printed Cu items are improved with the addition of Cu nanoparticles into the micron Cu powder. The increasement of 34% on electrical conductivity and 17% on tensile strength are reached by the addition of 50% Cu nanoparticles with the laser power of 240 W.

摘要

铜制品的三维(3D)打印是构建结构化铜材料的一种新方法,但由于铜材料的熔点高、热导率高和光反射率高,铜制品的3D打印通常具有挑战性。在本研究中,采用铜微球粉末与铜纳米颗粒的复合材料(微/纳米铜粉),通过选择性激光熔化技术实现铜制品的3D打印。由于在微米级铜粉中添加了铜纳米颗粒,微/纳米铜粉的烧结温度和热导率明显降低。结果表明,50%/50%微/纳米铜粉的3D打印需要100-240W的激光功率范围,相比之下,100%铜微球粉末的3D打印需要200-340W的激光功率范围。此外,在微米级铜粉中添加铜纳米颗粒后,3D打印铜制品的导电性、机械强度和密度都得到了提高。在240W激光功率下添加50%铜纳米颗粒,电导率提高了34%,拉伸强度提高了17%。