Ma Songhua, Bai Wuxin, Xiong Dajun, Shan Guibin, Zhao Zijie, Yi Wenbin, Wang Jieping
School of Chemistry and Chemical Engineering, Nanjing University of Science and Technology, Nanjing, 210094, China.
Herbert Gleiter Institute of Nanoscience, School of Material Science and Engineering, Nanjing University of Science and Technology, Nanjing, 210094, China.
Angew Chem Int Ed Engl. 2024 Jun 3;63(23):e202405135. doi: 10.1002/anie.202405135. Epub 2024 Apr 29.
Additive manufacturing (AM) of copper through laser-based processes poses challenges, primarily attributed to the high thermal conductivity and low laser absorptivity of copper powder or wire as the feedstock. Although the use of copper salts in vat photopolymerization-based AM techniques has garnered recent attention, achieving micro-architected copper with high conductivity and density has remained elusive. In this study, we present a facile and efficient process to create complex 3D micro-architected copper structures with superior electrical conductivity and hardness. The process entails the formulation of an ion-exchangeable photoresin, followed by the utilization of digital light processing (DLP) printing to sculpt 3D hydrogel scaffolds, which were transformed into Cu-chelated polymer frameworks (Cu-CPFs) with a high loading of Cu ions through ion exchange, followed by debinding and sintering, results in the transformation of Cu-CPFs into miniaturized copper architectures. This methodology represents an efficient pathway for the creation of intricate micro-architected 3D metal structures.
通过基于激光的工艺对铜进行增材制造存在挑战，这主要归因于作为原料的铜粉或铜丝的高导热性和低激光吸收率。尽管在基于光聚合反应的增材制造技术中使用铜盐最近受到了关注，但要获得具有高导电性和密度的微结构铜仍然难以实现。在本研究中，我们提出了一种简便高效的工艺，用于创建具有卓越导电性和硬度的复杂三维微结构铜结构。该工艺包括配制一种可离子交换的光致抗蚀剂，随后利用数字光处理（DLP）打印来雕刻三维水凝胶支架，通过离子交换将其转变为具有高负载铜离子的铜螯合聚合物框架（Cu-CPFs），然后进行脱脂和烧结，从而使Cu-CPFs转变为小型化的铜结构。这种方法代表了一种创建复杂微结构三维金属结构的有效途径。
