Rauh Simon, Prabhu Shashank Deepak, Wolf Gerhard, Fischer Lioba, Hempel Nico, Mayr Peter
Fraunhofer UMSICHT, Fraunhofer Institute for Environmental, Safety and Energy Technology, An der Maxhütte 1, 92237 Sulzbach-Rosenberg, Germany.
Chair of Materials Engineering of Additive Manufacturing, TUM School of Engineering and Design, Technical University of Munich, Freisinger Landstraße 52, 85748 Garching, Germany.
Materials (Basel). 2024 Sep 6;17(17):4394. doi: 10.3390/ma17174394.
The processing of pure copper (Cu) has been a challenge for laser-based additive manufacturing for many years since copper powders have a high reflectivity of up to 83% of electromagnetic radiation at a wavelength of 1070 nm. In this study, Cu particles were coated with sub-micrometer tungsten (W) particles to increase the laser beam absorptivity. The coated powders were processed by powder bed fusion-laser beam for metals (PBF-LB/M) with a conventional laser system of <300 watts laser power and a wavelength of 1070 nm. Two different powder manufacturing routes were developed. The first manufacturing route was gas atomization combined with a milling process by a planetary mill. The second manufacturing method was gas atomization with particle co-injection, where a separate W particle jet was sprayed into the atomized Cu jet. As part of the investigations, an extensive characterization of powder and additively manufactured test specimens was carried out. The specimens of Cu/W powders manufactured by the milling process have shown superior results. The laser absorptivity of the Cu/W powder was increased from 22.5% (pure Cu powder) to up to 71.6% for powders with 3 vol% W. In addition, a relative density of test specimens up to 98.2% (optically) and 95.6% (Archimedes) was reached. Furthermore, thermal conductivity was measured by laser flash analysis (LFA) and thermo-optical measurement (TOM). By using eddy current measurement, the electrical conductivity was analyzed. In comparison to the Cu reference, a thermal conductivity of 88.9% and an electrical conductivity of 85.8% were determined. Moreover, the Vickers hardness was measured. The effect of porosity on conductivity properties and hardness was investigated and showed a linear correlation. Finally, a demonstrator was built in which a wall thickness of down to 200 µm was achieved. This demonstrates that the Cu/W composite can be used for heat exchangers, heat sinks, and coils.
多年来,纯铜(Cu)的加工一直是基于激光的增材制造面临的一项挑战,因为铜粉对波长为1070nm的电磁辐射具有高达83%的高反射率。在本研究中,铜颗粒被亚微米级钨(W)颗粒包覆,以提高激光束吸收率。采用功率小于300瓦、波长为1070nm的传统激光系统,通过金属粉末床熔融激光束(PBF-LB/M)对包覆粉末进行加工。开发了两种不同的粉末制造路线。第一种制造路线是气体雾化结合行星式球磨机的研磨工艺。第二种制造方法是颗粒共注入气体雾化,即将单独的钨颗粒射流喷入雾化的铜射流中。作为研究的一部分,对粉末和增材制造的测试试样进行了广泛的表征。通过研磨工艺制造的铜/钨粉末试样显示出优异的结果。对于含3体积%钨的粉末,铜/钨粉末的激光吸收率从22.5%(纯铜粉末)提高到高达71.6%。此外,测试试样的相对密度在光学上达到了98.2%,在阿基米德法测量中达到了95.6%。此外,通过激光闪光分析(LFA)和热光测量(TOM)测量了热导率。通过使用涡流测量法分析了电导率。与铜参考样品相比,测定的热导率为88.9%,电导率为85.8%。此外,还测量了维氏硬度。研究了孔隙率对导电性能和硬度的影响,并显示出线性相关性。最后,制造了一个演示器,其壁厚达到了200μm。这表明铜/钨复合材料可用于热交换器、散热器和线圈。